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SKU BCM55045B1IFSBG

BCM55045B1IFSBG

by Broadcom Limited

BCM55045B1IFSBG from Broadcom Limited is a 10G XPON DPU CHIP

Package: Tray
Standard Package: 308

Integrated Circuits (ICs) / Embedded / System On Chip (SoC)

Type: System On Chip (SoC)
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Integrated Circuits (ICs)

Embedded

System On Chip (SoC)

Additional Details

COLOR:

STATUS: Active
PACKAGING: Tray
PER PACK: 308
MNF: Broadcom Limited
ALT PART:
MSL:
RoHS:
REACH:
HTSUS:
ECCN:

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