EVM-LEADLESS1

EVM-LEADLESS1 from Texas Instruments is a Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages. The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK, RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers. Features Quick testing of TI's surface mount packages Allows suface mount packages to be plugged into 100mil spaced bread board Supports TI's 16 most popular leadless packages with a single panel

Base Number: EVM-LEADLESS1
Package: Box
Standard Package: 1
RoHS: ROHS3 Compliant
REACH: Unaffected
MSL: Unlimited
ECCN: EAR99
HTSUS: 8473.30.1180

Prototyping, Fabrication Products / Adapter, Breakout Boards