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SKU QUAD-TSSOP-ADAPTER

QUAD-TSSOP-ADAPTER

Original price $44.50 - Original price $44.50
Original price
$44.50
$44.50 - $44.50
Current price $44.50
Availability:
Low stock

QUAD-TSSOP-ADAPTER from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

Base Number: QUAD
Package: Bulk
Standard Package: 1
RoHS: ROHS3 Compliant
REACH: Unaffected
MSL: Unlimited
ECCN: EAR99
HTSUS: 8473.30.1180

Prototyping, Fabrication Products / Adapter, Breakout Boards

Type: Adapter, Breakout Boards
Check Availability
Additional Details

COLOR:


STATUS: Active
PACKAGING: Bulk
PER PACK: 1
MNF: Texas Instruments
ALT PART: QUAD
OTHER: QUADTSSOPADAPTER
MSL: Unlimited
RoHS: ROHS3 Compliant
REACH: Unaffected
HTSUS: 8473.30.1180
ECCN: EAR99

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