ZSSC3170EE1D
ZSSC3170EE1D from IDT, Integrated Device Technology Inc is a DICE (WAFER SAWN) - WAFFLE PACK
Base Number: ZSSC3170
Package: Tray
Standard Package: 50
ECCN: EAR99
HTSUS: 8542.39.0001
Integrated Circuits (ICs) / Interface / Sensor and Detector Interfaces
Additional Details
COLOR:
STATUS: Active
PACKAGING: Tray
PER PACK: 50
MNF: IDT, Integrated Device Technology Inc
ALT PART:
MSL:
RoHS:
REACH:
HTSUS: 8542.39.0001
ECCN: EAR99