Search results for “ATS-03F”

The ATS-03F-95-C2-R0 from Advanced Thermal Solutions Inc. is a 40×40×30 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-191-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-87-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×20 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-191-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-85-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×10 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-188-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-191-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-116-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-88-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-165-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-98-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-81-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 30 mm × 30 mm × 20 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-03F-95-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm, with an R-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-54-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×35 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-58-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 35x35x25 mm with an L-tab mounting style (T412).

The ATS-03F-85-C1-R0 from Advanced Thermal Solutions Inc. is a 35×35×10 mm aluminum top-mount heat sink with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-95-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×30 mm with an R-tab profile and T412 designation.

The ATS-03F-80-C3-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm R-tab heat sink (T412).

The ATS-03F-53-C3-R0 from Advanced Thermal Solutions Inc. is a 30×30×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-141-C3-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 10 mm L-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-87-C3-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×20 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-54-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 × 30 × 35 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-03F-169-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 x 30 x 10 mm with an R-tab (T412), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03F-54-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 35 mm aluminum heat sink with an L-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-32-C1-R0 from Advanced Thermal Solutions Inc. is an assorted-application heat sink (BGA, LGA, CPU, ASIC) with aluminum top mount, measuring 57.9 x 36.83 x 11.43 mm.

The ATS-03F-85-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-35-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83 x 57.6 x 5.84 mm (T412), for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-32-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 57.9x36.83x11.43 mm (T412).

The ATS-03F-53-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 30 x 30 x 30 mm, with L-TAB code.

The ATS-03F-55-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm heat sink with L-TAB mounting (T412).

The ATS-03F-99-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-03F-175-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 35 x 35 x 10 mm (R-TAB, T412).

The ATS-03F-53-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×30 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-100-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 25 mm R-tab heat sink (T412).

The ATS-03F-93-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×20 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-88-C3-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-89-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 × 35 × 30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-87-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 20 mm with an R-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-03F-201-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50×50×12 mm, with an XCUT T412 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-144-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 x 30 x 25 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-03F-202-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 6 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-37-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with T412 designation.

The ATS-03F-37-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 17.78 mm (T766).

The ATS-03F-31-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 5.84 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-03F-32-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 11.43 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-73-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×10 mm R-tab aluminum heat sink (T412) with top mounting, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-113-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.