Search results for “ATS-03E”

The ATS-03E-157-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×30 mm with an L-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-107-C1-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-123-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 50x50x20 mm with an XCUT style (T766).

The ATS-03E-08-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm XCUT aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03E-119-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03E-103-C1-R1 from Advanced Thermal Solutions Inc. is a 40×40×9.5 mm XCUT aluminum heat sink with top mounting, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-23-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03E-22-C2-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 60 mm × 60 mm × 12.7 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-130-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 60 mm × 60 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-210-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 x 70 x 12 mm (XCUT), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03E-140-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 25 mm heat sink with L-TAB.

The ATS-03E-67-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45 x 45 x 10 mm with an L-tab (T766), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03E-24-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 20 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-03E-133-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-205-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted devices (BGA, LGA, CPU, ASIC) with XCUT T766 designation.

The ATS-03E-06-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 45 mm × 45 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-73-C2-R0 from Advanced Thermal Solutions Inc. is a 25 mm × 25 mm × 10 mm aluminum top-mount heat sink with R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages (T766).

The ATS-03E-20-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 54×54×25 mm with an X-cut profile and T412 designation.

The ATS-03E-160-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-08-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-126-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-48-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×35 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-110-C3-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03E-202-C2-R0 from Advanced Thermal Solutions Inc. is a 54 mm x 54 mm x 6 mm aluminum top-mount heat sink with X-Cut R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03E-125-C3-R0 from Advanced Thermal Solutions Inc. is a 54×54×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-101-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-144-C1-R0 from Advanced Thermal Solutions Inc. is a 30 mm × 30 mm × 25 mm L-TAB heat sink of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-07-C3-R0 from Advanced Thermal Solutions Inc. is an assorted-application aluminum heat sink (for BGA, LGA, CPU, ASIC and similar devices) measuring 45x45x12.7 mm, with top mount and XCUT (T412) design.

The ATS-03E-155-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with an L-tab and T766 designation.

The ATS-03E-115-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-113-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×10 mm with an X-cut design, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-114-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 15 mm XCUT aluminum heat sink (T766) for top mounting.

The ATS-03E-104-C2-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×12.7 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-18-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 54 x 54 x 15 mm, designated XCUT T766.

The ATS-03E-51-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 30 x 30 x 20 mm.

The ATS-03E-133-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-115-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 40 x 40 x 20 mm (XCUT, T766).

The ATS-03E-114-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 40 x 40 x 15 mm, with XCUT and T412 codes.

The ATS-03E-210-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount XCUT T412 heat sink measuring 70 x 70 x 12 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03E-41-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9x60.96x17.78 mm with T766 styling, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-130-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03E-23-C3-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 15 mm XCUT heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-02-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x12.7 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-27-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×12.7 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-129-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-03E-108-C2-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-07-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-196-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45 × 45 × 6 mm (XCUT), for BGA, LGA, CPU and ASIC devices.