Search results for “ats-13f”

The ATS-13F-170-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm heat sink (R-TAB).

The ATS-13F-17-C3-R0 from Advanced Thermal Solutions Inc. is a 54×54×12.7 mm aluminum top-mount heat sink with an X-cut design (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-204-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 54 x 54 x 12 mm.

The ATS-13F-03-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm X-cut heat sink.

The ATS-13F-27-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×12.7 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-89-C3-R0 from Advanced Thermal Solutions Inc. is a 35 mm × 35 mm × 30 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-160-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-206-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-13F-14-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 50x50x20 mm with an XCUT style (T766).

The ATS-13F-208-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 x 70 x 6 mm with an X-cut (T766), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-13F-148-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm L-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13F-166-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 25 mm × 25 mm × 15 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-13F-25-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 25 mm with an X-cut (T412), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-13F-148-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35×35×15 mm with an L-tab (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-13F-205-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount XCUT T412 heat sink measuring 60 x 60 x 6 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13F-161-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 45×45×20 mm with an L-tab profile and T412 designation.

The ATS-13F-69-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 45×45×20 mm with an L-tab profile and T412 designation.

The ATS-13F-36-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83 x 57.6 x 11.43 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13F-103-C3-R1 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 40 mm × 40 mm × 9.5 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-19-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-162-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×25 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-203-C3-R0 from Advanced Thermal Solutions Inc. is a 54×54×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-05-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-36-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 36.83 x 57.6 x 11.43 mm (T766).

The ATS-13F-38-C1-R0 from Advanced Thermal Solutions Inc. is a 36.83 x 57.6 x 22.86 mm heat sink.

The ATS-13F-149-C3-R0 from Advanced Thermal Solutions Inc. is a 35×35×20 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-68-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm L-TAB (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-202-C2-R0 from Advanced Thermal Solutions Inc. is a 54 mm x 54 mm x 6 mm aluminum top-mount heat sink with X-Cut R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13F-68-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-160-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm L-TAB (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-69-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-99-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×20 mm with an R-Tab (T766), for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-206-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-13F-163-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with an L-tab and T766 designation.

The ATS-13F-188-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-161-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 20 mm L-TAB heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-25-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-09-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-125-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 54×54×10 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-18-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm x 54 mm x 15 mm XCUT aluminum heat sink (T412) for top mounting.

The ATS-13F-69-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 20 mm L-TAB heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-04-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-158-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 35 mm aluminum top-mount heat sink with L-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13F-27-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 mm × 70 mm × 12.7 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-13F-19-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 20 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-36-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 11.43 mm (T412).

The ATS-13F-199-C3-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 6 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.