Search results for “VIP II”

The FDMS064GMG-N200 from Flexxon Pte Ltd is an SD memory card with 64GB of MLC storage.

The FDMS064GBG-3201 from Flexxon Pte Ltd is a 64 GB SD memory card using 3D TLC flash in the Gold grade.

The FDMM016GCG-3201 from Flexxon Pte Ltd is a 16 GB microSD memory card using 3D pSLC flash.

The FDMM032GPG-N200 from Flexxon Pte Ltd is a 32 GB microSD memory card using pSLC flash, from the FXPREM II series, in a gold-grade finish.

The R1QHA3618CBG-25IB0 from Renesas Electronics America Inc is a 36 Mbit DDR II + SRAM memory Integrated Circuit.

The MPC8313CVRAGDC from NXP USA Inc. is a PowerQUICC II Pro microprocessor Integrated Circuit in a 516-TEPBGA (27x27) package.

2901608 from Phoenix Contact is a VIP-CAB-FLK14/AXIO/0 14/2 5M

The FDMS032GBG-3201 from Flexxon Pte Ltd is a 32 GB SD memory card using 3D TLC flash in the Gold grade.

The FDMM064GMG-N200 from Flexxon Pte Ltd is a 64 GB microSD memory card using MLC flash, from the FXPREM II series, in a gold-grade finish.

The FDMS128GBE-3201 from Flexxon Pte Ltd is an FXADV II SD memory card with 128 GB of 3D TLC storage, in the Diamond Grade.

The FDMS256GBG-3201 from Flexxon Pte Ltd is an FXADV II SD memory card with 256 GB of 3D TLC storage, in the Gold Grade.

The FDMM064GPG-N200 from Flexxon Pte Ltd is a 64 GB microSD memory card using pSLC flash, from the FXPREM II series, in a gold-grade finish.

The FDMS256GME-N200 from Flexxon Pte Ltd is an FXPREM II SD memory card with 256 GB of MLC storage, in the Diamond Grade.

The PPROMCAMQ from Banner Engineering Corporation is an image sensor for the Mini Presence+ Pro II camera, with a 752H x 480V pixel array and 6 µm x 6 µm pixels.

The EP2A70F1508C9 from Intel is an APEX II field-programmable gate array (FPGA) Integrated Circuit with 1060 I/O, figures 1146880 and 67200, in a 1508-BBGA, FCBGA package.

The FDMS032GSE-N200 from Flexxon Pte Ltd is an SD memory card with 32GB of SLC storage.

The FDMM064GME-N200 from Flexxon Pte Ltd is a 64 GB microSD memory card using MLC flash, from the FXPREM II series, in a diamond-grade finish.

The 600108 from Dresden Elektronik is a RASPBEE II Radio Frequency transceiver finished unit.

The FDMM032GMG-N200 from Flexxon Pte Ltd is a 32GB FXPREM II microSD memory card with MLC flash and gold design.

The FDMS016GPG-N200 from Flexxon Pte Ltd is a 16 GB SD memory card using pSLC flash in the Gold grade.

The FDMM032GBE-3201 from Flexxon Pte Ltd is a 32GB FXADV II microSD memory card with 3D TLC flash (DIA).

The EP2SGX90FF1508C5 from Intel is a Stratix II GX FPGA Integrated Circuit with 650 I/O in a 1508-BBGA, FCBGA package, with figures 4520448 and 90960 included.

The GL125-DLTEMIMO-SM from PCTEL, Inc. is a Coach II multi-band antenna for BeiDou, Bluetooth, Cellular, Galileo, GLONASS, GNSS, GPS and Wi-Fi modules, covering 649 MHz, 750 MHz, 892 MHz, 1.955 GHz, 2.45 GHz, 2.495 GHz, 3.6 GHz and 5.4125 GHz, with bands of 600 to 698 MHz, 698 to 802 MHz, 824 to 960 MHz, 1.71 to 2.2 GHz, 2.3 to 2.5 GHz, 2.4 to 2.69 GHz, 3.4 to 3.8 GHz and 4.9 to 5.925 GHz, with 5.1 dBi gain and an SMA stud connector.

The FDMM016GME-N200 from Flexxon Pte Ltd is a 16 GB microSD memory card using MLC flash, from the FXPREM II series, in a diamond-grade finish.

The FDMM128GMG-N200 from Flexxon Pte Ltd is a 128 GB microSD memory card using MLC flash, from the FXPREM II series, in a gold-grade finish.

The T2F-RJ002-POE from Cinch Connectivity Solutions is a TFOCA II media converter for multimode (MM) fiber.

The MPC8260ACVVMHBB from NXP USA Inc. is a POWERQUICC II processor Integrated Circuit with a 256 specification.

The ESENSE II FAI DISP from Automation Components, Inc. is a carbon dioxide gas sensor with a 0-2000 PP measurement range.

The XA2C64A-7VQG100I from AMD is a CPLD Integrated Circuit with 64 macrocells and a 6.7 ns speed rating, in a 100-VQFP package.