Search results for โZynq UltraScaleโ
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TE0803-01-04CG-1EA
Trenz Electronic GmbHThe TE0803-01-04CG-1EA from Trenz Electronic GmbH is a Zynq UltraScale embedded module with 2GB and 128MB memory.
View full detailsTE0803-02-04EV-1EA
Trenz Electronic GmbHThe TE0803-02-04EV-1EA from Trenz Electronic GmbH is a Zynq UltraScale+ embedded module with XCZU4EV-1SFVC784E, 2GB and 128MB memory.
View full detailsTE0803-03-4DE11-A
Trenz Electronic GmbHThe TE0803-03-4DE11-A from Trenz Electronic GmbH is a Zynq UltraScale embedded module with 2GB and 128MB memory.
View full detailsTE0820-02-03CG-1EA
Trenz Electronic GmbHThe TE0820-02-03CG-1EA from Trenz Electronic GmbH is an embedded module with a Zynq UltraScale+ XCZU3CG-1SFVC784E, with 1 GB and 128 MB.
View full detailsTE0803-02-04EV-1E3
Trenz Electronic GmbHThe TE0803-02-04EV-1E3 from Trenz Electronic GmbH is a TE0803 embedded module with Zynq UltraScale+ XCZU4EV-1SFVC784E, 2GB and 128MB.
View full detailsXCZU49DR-1FSVF1760E
AMDThe XCZU49DR-1FSVF1760E from AMD is a Zynq UltraScale+ RFSoC system-on-chip FPGA with quad ARM Cortex-A53 MPCore and dual ARM Cortex-R5 processors with CoreSight, 930K+ logic cells, 500 MHz and 1.2 GHz, in a 1760-FCBGA (42.5x42.5) package.
View full detailsIW-G30M-C7EV-4E004G-E008G-BEA
iWave SystemsThe IW-G30M-C7EV-4E004G-E008G-BEA from iWave Systems is an embedded module built around a ZU7EV processor at 1.5 GHz, with ARM Cortex-A53, ARM Cortex-R5 and ARM Mali 400 MP2 components.
View full detailsXCZU1CG-2UBVA494E
AMDAMD Zynq UltraScale+ MPSoC CG FPGA combining dual ARM Cortex-A53 and Cortex-R5 processors with integrated CoreSight debugging. Features 81K+ logic cells, 533MHz processor speed, and 1.333GHz fabric clock. 494-pin BGA package (14x14mm) for embedded systems requiring heterogeneous processing, real-time control, and programmable logic in a single device. RoHS3 compliant, 72-hour MSL.
View full detailsTE0803-04-2BE11-A
Trenz Electronic GmbHThe TE0803-04-2BE11-A from Trenz Electronic GmbH is an embedded module with Zynq UltraScale+ XCZU2EG-1SFVC784E, 2 GB and 128 MB.
View full detailsXCZU17EG-2FFVD1760E
AMDThe XCZU17EG-2FFVD1760E from AMD is a Zynq UltraScale+ MPSoC EG system-on-chip with quad ARM Cortex-A53 MPCore, dual ARM Cortex-R5 and ARM Mali-400 MP2, 926K+ logic cells, 533 MHz, 600 MHz and 1.3 GHz clocks, in a 1760-FCBGA (42.5x42.5) package.
View full detailsTE0803-04-5DE11-A
Trenz Electronic GmbHThe TE0803-04-5DE11-A from Trenz Electronic GmbH is an embedded module with Zynq UltraScale+ XCZU5EV-1SFVC784E, 2GB and 128MB.
View full detailsTE0820-03-04CG-1ED
Trenz Electronic GmbHThe TE0820-03-04CG-1ED from Trenz Electronic GmbH is a Zynq UltraScale+ embedded module with 2GB and 128MB.
View full detailsTE0803-04-3AE11-A
Trenz Electronic GmbHThe TE0803-04-3AE11-A from Trenz Electronic GmbH is an embedded module based on the Zynq UltraScale+ XCZU3CG-1SFVC784E FPGA, with 2 GB and 128 MB.
View full detailsME-XU8-4CG-1E-D11E-R2.1
Enclustra FPGA SolutionsThe ME-XU8-4CG-1E-D11E-R2.1 from Enclustra FPGA Solutions is a Zynq UltraScale+ ZU4CG embedded module with ARM Quad-Core Cortex-A53, ARM Dual-Core Cortex-R5 and Mali-400MP2 GPU at 533 MHz and 1.333 GHz, with 1 GB, 2 GB and 16 GB memory.
View full detailsTE0803-02-03EG-1EA
Trenz Electronic GmbHThe TE0803-02-03EG-1EA from Trenz Electronic GmbH is an embedded module built around the Zynq UltraScale+ XCZU3EG-1SFVC784E with 2GB and 128MB.
View full detailsTE0803-04-4DE11-A
Trenz Electronic GmbHThe TE0803-04-4DE11-A from Trenz Electronic GmbH is a TE0803 embedded module with a Zynq UltraScale+ XCZU4EV-1SFVC784E, with 2GB and 128MB memory specifications.
View full detailsTE0803-02-04CG-1EA
Trenz Electronic GmbHThe TE0803-02-04CG-1EA from Trenz Electronic GmbH is a TE0803 embedded module with Zynq UltraScale+ XCZU4CG-1SFVC784E, 2GB and 128MB.
View full detailsSM-K26-XCL2GC
AMDThe SM-K26-XCL2GC from AMD is a Kria Zynq UltraScale+ embedded module with ARM Cortex-A53 and Arm Cortex-R5F at 533 MHz and 1.333 GHz, 4 GB, 16 GB eMMC and 64 MB QSPI.
View full detailsTE0803-04-2AE11-A
Trenz Electronic GmbHThe TE0803-04-2AE11-A from Trenz Electronic GmbH is an embedded module with Zynq UltraScale+ XCZU2CG-1SFVC784E, 2 GB and 128 MB memory.
View full detailsTE0803-04-4DE21-L
Trenz Electronic GmbHThe TE0803-04-4DE21-L from Trenz Electronic GmbH is a TE0803 embedded module with a Zynq UltraScale+ XCZU4EV-1SFVC784E, with memory given as 2GB and 128MB and 4GB and 128MB.
View full detailsTE0820-03-02CG-1ED
Trenz Electronic GmbHThe TE0820-03-02CG-1ED from Trenz Electronic GmbH is an embedded module with a Zynq UltraScale+ XCZU2CG-1SFVC784E device and 2GB and 128MB capacities.
View full detailsIW-G35M-19EG-4E004G-E008G-BIA
iWave SystemsThe IW-G35M-19EG-4E004G-E008G-BIA from iWave Systems is a ZU19EG (-1 speed) MPSoC system-on-module.
View full detailsTE0803-04-4BE11-A
Trenz Electronic GmbHThe TE0803-04-4BE11-A from Trenz Electronic GmbH is an embedded module based on the Zynq UltraScale+ XCZU4EG-1SFVC784E with 2 GB and 128 MB memory.
View full detailsXCZU48DR-1FFVE1156E
AMDThe XCZU48DR-1FFVE1156E from AMD is a Zynq UltraScale+ RFSoC system-on-chip (SoC) FPGA with quad ARM Cortex-A53 MPCore and dual ARM Cortex-R5 with CoreSight, 930K+ Logic Cells, 500 MHz and 1.2 GHz, in a 1156-FCBGA (35x35) package.
View full detailsTE0807-02-04EG-1E
Trenz Electronic GmbHThe TE0807-02-04EG-1E from Trenz Electronic GmbH is an embedded module based on the Zynq UltraScale (USCALE) FPGA platform.
View full detailsTE0803-02-03EG-1EB
Trenz Electronic GmbHThe TE0803-02-03EG-1EB from Trenz Electronic GmbH is an embedded module with a Zynq UltraScale+ XCZU3EG-1SFVC784E device and 4GB and 128MB capacities.
View full detailsTE0820-03-03EG-1EL
Trenz Electronic GmbHThe TE0820-03-03EG-1EL from Trenz Electronic GmbH is an embedded module built around the Zynq UltraScale+ XCZU3EG-1SFVC784E with 2GB and 128MB.
View full detailsTE0803-01-02EG-1EA
Trenz Electronic GmbHThe TE0803-01-02EG-1EA from Trenz Electronic GmbH is an embedded module with Zynq UltraScale+ XCZU2EG-1SFVC784E, 2GB and 128MB.
View full detailsTE0803-03-2BE11-A
Trenz Electronic GmbHThe TE0803-03-2BE11-A from Trenz Electronic GmbH is a Zynq UltraScale+ embedded module with XCZU2EG-1SFVC784E, 2GB and 128MB memory.
View full detailsTE0803-03-3AE11-A
Trenz Electronic GmbHThe TE0803-03-3AE11-A from Trenz Electronic GmbH is a TE0803 embedded module with a Zynq UltraScale+ XCZU2CG-1SFVC784E, 2GB and 128MB.
View full detailsTE0820-03-02EG-1EL
Trenz Electronic GmbHThe TE0820-03-02EG-1EL from Trenz Electronic GmbH is an embedded module built around the Zynq UltraScale+ XCZU2EG-1SFVC784E with 2GB and 128MB.
View full detailsTE0820-03-02EG-1ED
Trenz Electronic GmbHThe TE0820-03-02EG-1ED from Trenz Electronic GmbH is an embedded module with a Zynq UltraScale+ XCZU2EG-1SFVC784E device and 2GB and 128MB capacities.
View full detailsTE0803-03-4AE11-A
Trenz Electronic GmbHThe TE0803-03-4AE11-A from Trenz Electronic GmbH is an embedded module with a Zynq UltraScale+ XCZU4CG-1SFVC784E device and 2GB and 128MB capacities.
View full detailsTE0803-03-2AE11-A
Trenz Electronic GmbHThe TE0803-03-2AE11-A from Trenz Electronic GmbH is a Zynq UltraScale embedded module with 2GB and 128MB memory.
View full detailsTE0820-03-03EG-1ED
Trenz Electronic GmbHThe TE0820-03-03EG-1ED from Trenz Electronic GmbH is an embedded module with Zynq UltraScale+ XCZU3EG-1SFVC784E, 2 GB and 128 MB.
View full detailsTE0803-02-02EG-1EA
Trenz Electronic GmbHThe TE0803-02-02EG-1EA from Trenz Electronic GmbH is a TE0803 embedded module with Zynq UltraScale+ XCZU2EG-1SFVC784E, 2GB and 128MB.
View full detailsIW-G35M-19EG-4E004G-E008G-BEF
iWave SystemsThe IW-G35M-19EG-4E004G-E008G-BEF from iWave Systems is a ZU19EG MPSOC system on module (-3 speed).
View full detailsXCZU42DR-L1FSVE1156I
AMDThe XCZU42DR-L1FSVE1156I from AMD is an RFSoC (ZUP, LP) system-on-chip with an A53 processor and FPGA, in a 1156-BGA package.
View full detailsXCZU2EG-1UBVA530E
AMDXCZU2EG-1UBVA530E from AMD is a IC ZUP MPSOC A53 FPGA 530-PIN BGA
View full detailsTE0803-02-04EG-1E3
Trenz Electronic GmbHThe TE0803-02-04EG-1E3 from Trenz Electronic GmbH is an embedded module built around the Zynq UltraScale+ XCZU4EG-1SFVC784E with 2GB and 128MB.
View full detailsXCZU2EG-2UBVA530E
AMDThe XCZU2EG-2UBVA530E from AMD is a Zynq UltraScale+ MPSoC EG FPGA with quad ARM Cortex-A53 MPCore and dual ARM Cortex-R5 processors with CoreSight, ARM Mali-400 MP2, 103K+ logic cells, 533 MHz, 600 MHz and 1.333 GHz clocks, in a 530-FCBGA (16x9.5) package.
View full detailsXCZU49DR-1FFVF1760E
AMDThe XCZU49DR-1FFVF1760E from AMD is a Zynq UltraScale+ RFSoC system-on-chip FPGA with quad ARM Cortex-A53 MPCore and dual ARM Cortex-R5 processors with CoreSight, 930K+ logic cells, 500 MHz and 1.2 GHz, in a 1760-FCBGA (42.5x42.5) package.
View full detailsXCZU1CG-1UBVA494I
AMDThe XCZU1CG-1UBVA494I from AMD is a Zynq UltraScale+ MPSoC CG system-on-chip with dual ARM Cortex-A53 MPCore and dual ARM Cortex-R5 processors with CoreSight, 81K+ logic cells, 500 MHz and 1.2 GHz, in a 494-FCBGA (14x14) package.
View full detailsXCZU3EG-2UBVA530E
AMDThe XCZU3EG-2UBVA530E from AMD is a Zynq UltraScale+ MPSoC EG system-on-chip with quad ARM Cortex-A53 MPCore, dual ARM Cortex-R5 and ARM Mali-400 MP2 cores, 154K+ logic cells, and 533 MHz, 600 MHz and 1.333 GHz clocks, in a 530-FCBGA (16x9.5) package.
View full detailsXCZU1CG-2UBVA494I
AMDThe XCZU1CG-2UBVA494I from AMD is a Zynq UltraScale+ MPSoC CG system-on-chip with A53 processing and FPGA logic, in a 494-BGA package.
View full detailsTE0808-05-9BE21-A
Trenz Electronic GmbHThe TE0808-05-9BE21-A from Trenz Electronic GmbH is an UltraScale+ MPSoC module with Zynq.
View full detailsXCZU49DR-L1FFVF1760I
AMDThe XCZU49DR-L1FFVF1760I from AMD is a Zynq UltraScale+ RFSoC FPGA SoC with quad ARM Cortex-A53 MPCore and dual Cortex-R5 processors with CoreSight, 930K+ logic cells, 500 MHz and 1.2 GHz speeds, in a 1760-FCBGA (42.5x42.5) LP package.
View full detailsXCZU2CG-1UBVA530E
AMDThe XCZU2CG-1UBVA530E from AMD is a Zynq UltraScale+ MPSoC CG system-on-chip Integrated Circuit with dual ARM Cortex-A53 MPCore and dual ARM Cortex-R5 with CoreSight, 103K+ logic cells, 500 MHz and 1.2 GHz, in a 530-FCBGA (16x9.5) package.
View full details