Search results for “adaptec hba”

NA5-7W-ADAPTER-NS8 from Omron Automation and Safety is a NA5-7W FROM NS8 ADAPTER PLATE

2275400-R from Microchip Technology is a ADAPTEC FLASH MODULE SUPERCAP 70

D-SOIC-ADAPTER-EVM from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

RJ45ADAPTER-10 from Thomas Research Products is a RJ45 ADAPTER FOR WIHUBB 10 PACK

IP65 ADAPTER SET from Fluke Electronics is a FLUKE-174X POWER QUALITY LOGGER

SOIC-ADAPTER-EVM from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

84W ADAPTOR from iBASE Technology is a 90~240VAC INPUT, 12V DC OUTPUT,

PBB-BB-24-620-HBA-AG from Carling Technologies is a CIRCUIT BREAKER

OS32-ADAPT-OS31-A1 from Omron Automation and Safety is a CABLE ASSY OS32C TO OS3101-A1

AT-1319-78-SOLDTCT-ADAPT from TE Connectivity Raychem Cable Protection is a SOLDTCT ADAPT

ADAM-5017H-BE from Advantech Corp is a 8-CHANNEL HIGH-SPEED ANALOG INPU

HBC1794A from Winchester Interconnect is a CONNECTOR HDBNC PLUG STR 75 OHM CRIMP

ADAM-6541-AE from Advantech Corp is a 10/100T TO MULTI-MODE FIBER MEDI

QUAD-TSSOP-ADAPTER from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

HBC1694A(U) from Winchester Interconnect is a CONNECTOR HDBNC PLUG STR 75 OHM CRIMP