Search results for “hfg”

The 420HFG680MBN40X55 from Rubycon is a 680 µF ±20% 420 V radial aluminum electrolytic capacitor with a 4-lead can, rated 5000 hours at 105 °C.

The 350HFG2700MBN45X100 from Rubycon is a 2700 µF, 350 V aluminum electrolytic capacitor in a radial can, 4-lead, rated 5000 hours at 105 °C, with 20% tolerance.

The 450HFG1200MBN40X90 from Rubycon is a 1200 µF 20% 450 V aluminum electrolytic capacitor with radial leads.

The 450HFG1200MBN45X70 from Rubycon is a 1200 µF 20% 450 V aluminum electrolytic capacitor with radial leads.

The 350HFG1500MBN35X95 from Rubycon is a radial aluminum electrolytic capacitor rated 1500 µF ±20% at 350 V.

TLK2711HFG/EM from Texas Instruments is a Integrated Circuit Radiation-tolerant, QML-V, 1.6 to 2.5Gbps transceiver - Other interfaces. The TLK2711-SP is a member of the WizardLink transceiver family of multigigabit transceivers, intended for use in ultra-high-speed bidirectional point-to-point data transmission systems. The TLK2711-SP supports an effective serial interface speed of 1.6Gbps to 2.5Gbps, providing up to 2Gbps of data bandwidth. The primary application of the TLK2711-SP is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50Ω. The transmission media can be printed circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment. This device can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power and cost savings over parallel solutions, as well as scalability for higher data rates in the future. The TLK2711-SP performs parallel-to-serial and serial-to-parallel data conversion. The clock extraction functions as a physical layer (PHY) interface device. The serial transceiver interface operates at a maximum speed of 2.5Gbps. The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (TXCLK). The 16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8b/10b) encoding format. The resulting 20-bit word is then transmitted differentially at 20× the reference clock (TXCLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the recovered clock (RXCLK). It then decodes the 20-bit wide data using the 8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data pins (RXD0-RXD15). The outcome is an effective data payload of 1.28Gbps to 2Gbps (16 bits data × the frequency). The TLK2711-SP is available in a 68-pin ceramic nonconductive tie-bar package (HFG). The TLK2711-SP provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer, providing the protocol device with a functional self-check of the physical interface.

The 350HFG820MBN35X60 from Rubycon is an 820 µF ±20% 350 V radial aluminum electrolytic capacitor in a can with 4 leads, rated 5000 hours at 105 °C.

The 350HFG1000MBN40X60 from Rubycon is a 1000 µF ±20% 350 V aluminum electrolytic capacitor with 4 leads in a radial can, rated 5000 hours at 105 °C.

The 450HFG680MBN40X60 from Rubycon is a 680 µF ±20% aluminum electrolytic capacitor rated 450 V, radial can with 4 leads, with 5000 hours at 105°C.

The 450HFG470MBN35X55 from Rubycon is a 470 µF ±20% 450 V radial aluminum electrolytic capacitor with 4 leads, rated 5000 hours at 105 °C.

The 350HFG1200MBN45X55 from Rubycon is a 1200 µF ±20% 350 V aluminum electrolytic capacitor in a radial can with 4 leads, rated 5000 hours at 105°C.

The 400HFG2200MBN45X100 from Rubycon is a 2200 µF ±20% 400 V aluminum electrolytic capacitor in a radial, 4-lead can, rated 5000 hours at 105 °C.

The 350HFG820MBN40X50 from Rubycon is an 820 µF ±20% 350 V radial aluminum electrolytic capacitor in a can with 4 leads, rated 5000 hours at 105 °C.

The 450HFG680MBN35X70 from Rubycon is a 680 µF ±20% aluminum electrolytic capacitor rated 450 V, radial can with 4 leads, with 5000 hours at 105°C.

ADS5463HFG/EM from Texas Instruments is a Integrated Circuit Radiation-hardened, QML-V, 100krad, 12-bit single 500MSPS ADC - High-speed ADCs (≥10 MSPS). The ADS5463 is a 12-bit, 500-MSPS analog-to-digital converter (ADC) that operates from both a 5-V supply and 3.3-V supply, while providing LVDS-compatible digital outputs from the 3.3-V supply. The ADS5463 input buffer isolates the internal switching of the onboard track and hold (T and H) from disturbing the signal source. An internal reference generator is also provided to simplify the system design further. The ADS5463 has outstanding low noise and linearity over input frequency. The ADS5463 is available in a 84-pin ceramic nonconductive tie-bar package (HFG). The ADS5463 is built on state-of-the-art Texas Instruments complementary bipolar process (BiCom3X) and is specified over the full military temperature range (-55°C to 125°C T case).

The 350HFG1500MBN45X65 from Rubycon is a 1500 µF ±20% 350 V aluminum electrolytic capacitor in a 4-lead radial can package, rated 5000 hours at 105°C.

The HF322NRG from Siemens is an HDSS fuse with 3 poles and 4 wires, rated 240 V and 60 A, coded N3R G BAR.

The 350HFG1800MBN40X90 from Rubycon is an 1800 µF ±20% 350 V radial aluminum electrolytic capacitor in a 4-lead can, rated 5000 hours at 105°C.

The 450HFG560MBN35X60 from Rubycon is a 560 µF, 20% tolerance, 450 V radial aluminum electrolytic capacitor.

The 350HFG1200MBN40X65 from Rubycon is a 1200 µF ±20% 350 V aluminum electrolytic capacitor in a radial can with 4 leads, rated 5000 hours at 105°C.

The 400HFG1200MBN35X95 from Rubycon is a 1200 µF ±20% 400 V aluminum electrolytic capacitor in a radial package.

The 420HFG470MBN35X50 from Rubycon is a 470 µF ±20% 420 V radial 4-lead aluminum electrolytic capacitor rated for 5000 hours at 105 °C.

The 400HFG680MBN40X50 from Rubycon is a 680 µF ±20% 400 V aluminum electrolytic capacitor in a radial can with 4 leads, rated for 5000 hours at 105 °C.

The 450HFG680MBN45X50 from Rubycon is a 680 µF ±20% aluminum electrolytic capacitor rated 450 V, radial can with 4 leads, with 5000 hours at 105°C.

The HF363RG from Siemens is a fused HDSS (N3R G BA) unit rated 600 V and 100 A, 3-pole 3-wire (3P3W).

The HF362RG from Siemens is an HDSS fuse, 3-pole 3-wire, rated 600 V and 60 A, with N3R and G bar.

ADS5474HFG/EM from Texas Instruments is a Integrated Circuit Radiation-hardened, QML-V, 100krad, 14-bit single, 400MSPS ADC - High-speed ADCs (≥10 MSPS). The ADS5474 is a 14-bit, 400MSPS analog-to-digital converter (ADC) that operates from both a 5V supply and 3.3V supply while providing LVDS-compatible digital outputs. This ADC is one of a family of 12-, 13-, 14-bit ADCs that operate from 210MSPS to 500MSPS. The ADS5474 input buffer isolates the internal switching of the onboard track and hold (T&H) from disturbing the signal source while providing a high-impedance input. An internal reference generator is also provided to simplify the system design. Designed with a 1.4GHz input bandwidth for the conversion of wide-bandwidth signals that exceed 400MHz of input frequency at 400MSPS, the ADS5474 has outstanding low noise performance and spurious-free dynamic range over a large input frequency range. The ADS5474 is available in an 84-pin ceramic non-conductive tie-bar package (HFG). The device is built on Texas Instruments complementary bipolar process (BiCom3) and is specified over the full military temperature range (-55°C to 125°C Tcase).

The 350HFG1800MBN45X75 from Rubycon is an 1800 µF ±20% 350 V radial aluminum electrolytic capacitor in a 4-lead can, rated 5000 hours at 105°C.

The HF321NRG from Siemens is an HDSS fuse accessory (3P4W, N3R G BAR) rated 240 V and 30 A.

The HFC322NR from Siemens is a 3P4W CSA fuse rated 240 V and 60 A (HDSS, N3R).

The HFCG-1500+ from Mini-Circuits is a high-pass ceramic filter with a 3.8 GHz center frequency (4.4 GHz) and 50 Ω impedance, in a 0805 (2012 metric) package with 6 PC pads.

HFCG-2000+ from Mini-Circuits is a LTCC HIGH PASS FILTER, 2100 - 10

The HF361RG from Siemens is an HDSS fuse with 3 poles and 3 wires, rated 600 V and 30 A, coded N3R G BAR.

ADS5424HFG/EM from Texas Instruments is a Integrated Circuit Radiation-hardened, QML-V, 150krad, 14-bit single-channel 125MSPS ADC - High-speed ADCs (≥10 MSPS). The ADS5424 is a 14-bit, 105-MSPS analog-to-digital converter (ADC) that operates from a 5-V supply, while providing 3.3-V CMOS compatible digital outputs. The ADS5424 input buffer isolates the internal switching of the on-chip track and hold (T&H) from disturbing the signal source. An internal reference generator is also provided to further simplify the system design. The ADS5424 has outstanding low noise and linearity, over input frequency. With only a 2.2-V PP input range, ADS5424 simplifies the design of multicarrier applications, where the carriers are selected on the digital domain. The ADS5424 is available in a 52-pin ceramic nonconductive tie-bar package (HFG). The ADS5424 is built on state of the art Texas Instruments complementary bipolar process (BiCom3) and is specified over full military temperature range (-55°C to 125°C T case) This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI typically recommends a 16-mm 2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential.

ADS5444HFG/EM from Texas Instruments is a Integrated Circuit QML-V, 13-bit single-channel 250MSPS ADC - High-speed ADCs (≥10 MSPS). The ADS5444 is a 13 bit 250 MSPS analog-to-digital converter (ADC) that operates from a 5 V supply, while providing LVDS-compatible digital outputs from a 3.3 V supply. The ADS5444 input buffer isolates the internal switching of the onboard track and hold (T&H) from disturbing the signal source. An internal reference generator is also provided to further simplify the system design. The ADS5444 has outstanding low noise and linearity over input frequency. The ADS5444 is available in a 84 pin ceramic nonconductive tie-bar package (HFG). The ADS5444 is built on a state-of-the-art Texas Instruments complementary bipolar process (BiCom3X) and is specified over the full military temperature range (-55°C to 125°C T case). This CQFP package has built in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI typically recommends an 11,9-mm 2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad must be electrically at ground potential.

The HFCG-1760+ from Mini-Circuits is a high-pass ceramic filter with a 4.9 GHz center frequency (6.2 GHz) and 50 Ω impedance, in a 0805 (2012 metric) package with 6 PC pads.