Search results for “ATE”

The ATS-15A-35-C1-R0 from Advanced Thermal Solutions Inc. is a 36.83 x 57.6 x 5.84 mm aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-15F-90-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×35 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15A-27-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×12.7 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03A-161-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-06A-170-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab heat sink measuring 30 x 30 x 15 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03A-149-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 35x35x20 mm with an L-tab mounting style (T766).

The ATS-CHILL300V from Advanced Thermal Solutions Inc. is an active recirculating chiller rated 300 W, operating at 120/220 VAC with a flow of 3.96 GPM (15.0 LPM).

The ATS-14G-158-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×35 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-15A-127-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-15A-24-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 20 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-10G-167-C1-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 25×25×20 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08A-74-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-07A-22-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-10A-107-C2-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15A-107-C2-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-07A-15-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-01C-02-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x12.7 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-12E-130-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-15E-76-C2-R0 from Advanced Thermal Solutions Inc. is an R-TAB heat sink measuring 25 x 25 x 25 mm (T766).

The ATS-15A-132-C2-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-64-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab heat sink measuring 40 mm x 40 mm x 25 mm (T766).

The ATS-01A-85-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×10 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-10E-41-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9x60.96x17.78 mm with T766 styling, for BGA, LGA, CPU and ASIC devices.

The ATS-12A-152-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 35 mm, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13A-197-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-15A-202-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 6 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-15F-139-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 25 mm × 25 mm × 20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-12A-28-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 mm x 70 mm x 15 mm, for assorted BGA, LGA, CPU and ASIC packages.

The ATS-13B-187-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20E-140-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum L-tab heat sink with a T766 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-15F-149-C1-R0 from Advanced Thermal Solutions Inc. is a 35×35×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15A-156-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×25 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-14A-132-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13A-116-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-15A-208-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 x 70 x 6 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-16A-150-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-16A-100-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×25 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-EXL76-300-R1 from Advanced Thermal Solutions Inc. is an AL6063 aluminum extruded top-mount heat sink measuring 300×93.4×40 mm.

The ATS-16A-10-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 45×45×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-16A-178-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-01A-109-C1-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03A-197-C2-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 10 mm heat sink (XCUT T766).

The ATS-08A-01-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-15E-107-C3-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-01B-145-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30x30x30 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.