Search results for “13F”

The ATS-13F-146-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 × 30 × 35 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-13F-108-C2-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-103-C1-R1 from Advanced Thermal Solutions Inc. is a 40×40×9.5 mm XCUT aluminum heat sink with top mounting, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-168-C1-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum R-tab heat sink for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-137-C3-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13F-32-C3-R0 from Advanced Thermal Solutions Inc. is a T412 heat sink measuring 57.9 x 36.83 x 11.43 mm.

The ATS-13F-57-C3-R0 from Advanced Thermal Solutions Inc. is a 35×35×20 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-65-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for BGA, LGA, CPU and ASIC devices, measuring 40 mm x 40 mm x 30 mm.

The ATS-13F-132-C3-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 25 mm heat sink (XCUT T412).

The ATS-13F-05-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-209-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-121-C1-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 10 mm heat sink (XCUT).

The ATS-13F-115-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 40x40x20 mm with an XCUT style (T412).

The ATS-13F-134-C3-R0 from Advanced Thermal Solutions Inc. is an X-Cut heat sink measuring 70x70x15 mm, T412 series.

The ATS-13F-117-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-104-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x12.7 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-59-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×30 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-63-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an L-tab and T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-11-C1-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 10 mm heat sink (XCUT).

The ATS-13F-117-C3-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 10 mm heat sink (XCUT, T412).

The ATS-13F-85-C1-R0 from Advanced Thermal Solutions Inc. is an R-tab heat sink measuring 35 x 35 x 10 mm.

The ATS-13F-02-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×12.7 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-93-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×20 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-52-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab heat sink measuring 30 x 30 x 25 mm.

The ATS-13F-77-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 25×25×30 mm with an R-tab, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-157-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×30 mm with an L-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-204-C2-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 12 mm XCUT (T766) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-157-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-13F-44-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink (L-TAB) measuring 25 x 25 x 15 mm.

The ATS-13F-132-C2-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-207-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with XCUT designation.

The ATS-13F-195-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×12 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-90-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×35 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The M85049/130-13F from Amphenol Interconnect India is a blue fluorosilicone connector gasket.

The ATS-13F-07-C2-R0 from Advanced Thermal Solutions Inc. is an assorted-use aluminum heat sink measuring 45×45×12.7 mm, for BGA, LGA, CPU and ASIC devices, with a top-mount design.

The ATS-13F-176-C1-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm aluminum heat sink with an R-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-17-C3-R0 from Advanced Thermal Solutions Inc. is a 54×54×12.7 mm aluminum top-mount heat sink with an X-cut design (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-115-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-112-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-13F-103-C2-R1 from Advanced Thermal Solutions Inc. is a 40×40×9.5 mm top-mount aluminum heat sink (T766) for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-207-C2-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 60×60×12 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-03-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 15 mm XCUT aluminum heat sink (T766) for top mounting.

The ATS-13F-203-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 54×54×10 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-142-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13F-72-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 45x45x35 mm.

The ATS-13F-153-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm heat sink with L-TAB (T412).