Search results for “ATS-08B”

The ATS-08B-194-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-125-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-24-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 20 mm heat sink with XCUT.

The ATS-08B-89-C3-R0 from Advanced Thermal Solutions Inc. is a 35 mm × 35 mm × 30 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-89-C2-R0 from Advanced Thermal Solutions Inc. is a 35 mm x 35 mm x 30 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-08B-56-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35×35×15 mm with an L-tab (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-08B-11-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-51-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 30 x 30 x 20 mm.

The ATS-08B-128-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×25 mm, XCUT, with T766 designation, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-58-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 35x35x25 mm with an L-tab mounting style (T412).

The ATS-08B-33-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted devices (BGA, LGA, CPU, ASIC), measuring 57.9 × 36.83 × 17.78 mm.

The ATS-08B-80-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×15 mm, with an R-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-08B-76-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum R-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-182-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×15 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-22-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-08B-30-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink measuring 70 x 70 x 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-08B-205-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted devices (BGA, LGA, CPU, ASIC) with XCUT T766 designation.

The ATS-08B-111-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-08B-32-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 11.43 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-101-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-31-C1-R0 from Advanced Thermal Solutions Inc. is a 57.9 x 36.83 x 5.84 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-130-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm heat sink (XCUT).

The ATS-08B-15-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-08B-48-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×35 mm aluminum top-mount heat sink with an L-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08B-94-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 25 mm heat sink (R-TAB) for thermal management.

The ATS-08B-128-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 54×54×25 mm with an X-cut profile and T412 designation.

The ATS-08B-83-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 30×30×30 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-137-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-08B-110-C1-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-08B-137-C2-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm L-tab heat sink (T766).

The ATS-08B-171-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab heat sink measuring 30 x 30 x 20 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-08B-54-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×35 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-08B-98-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-76-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 25×25×25 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-08B-95-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm, with an R-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-08B-111-C2-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-08B-209-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-38-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (T766) measuring 36.83 x 57.6 x 22.86 mm.

The ATS-08B-98-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-08B-17-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (XCUT, T766) measuring 54 x 54 x 12.7 mm.

The ATS-08B-32-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 57.9x36.83x11.43 mm (T412).

The ATS-08B-31-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with T766 designation.

The ATS-08B-34-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 22.86 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-08B-102-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 35 mm R-TAB aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-08B-56-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 15 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-08B-135-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-08B-209-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.