Search results for “ATS-13D”

The ATS-13D-26-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-101-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-151-C1-R0 from Advanced Thermal Solutions Inc. is a 35 mm x 35 mm x 30 mm L-tab heat sink.

The ATS-13D-140-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum L-tab heat sink with a T766 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-96-C1-R0 from Advanced Thermal Solutions Inc. is a 40×40×35 mm aluminum heat sink with R-tab top mount, for BGA, LGA, CPU and ASIC packages.

The ATS-13D-135-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-153-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-137-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×10 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-76-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 25×25×25 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-13D-145-C3-R0 from Advanced Thermal Solutions Inc. is a 30×30×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-138-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 25×25×15 mm, with an L-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-25-C2-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-25-C3-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 25 mm heat sink (XCUT T412).

The ATS-13D-88-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-16-C3-R0 from Advanced Thermal Solutions Inc. is a 54×54×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-124-C3-R0 from Advanced Thermal Solutions Inc. is a 50×50×25 mm cross-cut (XCUT) aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-61-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-79-C2-R0 from Advanced Thermal Solutions Inc. is a 30 mm x 30 mm x 10 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-202-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 6 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-165-C2-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm R-TAB heat sink (T766).

The ATS-13D-176-C1-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm aluminum heat sink with an R-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-140-C3-R0 from Advanced Thermal Solutions Inc. is a T412 L-tab heat sink measuring 25 x 25 x 25 mm.

The ATS-13D-82-C3-R0 from Advanced Thermal Solutions Inc. is a 30 mm × 30 mm × 25 mm R-TAB heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-193-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40x40x6 mm.

The ATS-13D-171-C2-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 20 mm aluminum top-mount heat sink with R-tab for assorted BGA, LGA, CPU and ASIC devices (T766).

The ATS-13D-124-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13D-190-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×25 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-184-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×25 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-114-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices (XCUT T412).

The ATS-13D-144-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 x 30 x 25 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-13D-56-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35×35×15 mm with an L-tab (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-13D-181-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13D-87-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×20 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-182-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-112-C3-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-13D-170-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×15 mm, with an R-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-142-C3-R0 from Advanced Thermal Solutions Inc. is an L-TAB heat sink measuring 30 x 30 x 15 mm (T412).

The ATS-13D-35-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83×57.6×5.84 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-111-C3-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-13D-77-C2-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 30 mm R-TAB heat sink (T766).

The ATS-13D-135-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×20 mm with an XCUT T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-174-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab T766 heat sink measuring 30 x 30 x 35 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13D-82-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 25 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13D-86-C1-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm aluminum heat sink with an R-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-198-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45×45×12 mm.

The ATS-13D-24-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 20 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-01-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×10 mm with an X-cut design, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-201-C1-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 50x50x12 mm with an XCUT style.