Search results for “ATS-18C”

The ATS-18C-97-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×10 mm with an R-Tab, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-189-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-18C-89-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 × 35 × 30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-18C-34-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 22.86 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-18C-194-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 10 mm XCUT heat sink (T766).

The ATS-18C-140-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum L-tab heat sink with a T766 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-186-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 35 mm R-TAB (T766) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-18C-35-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (T766) measuring 36.83 x 57.6 x 5.84 mm.

The ATS-18C-132-C2-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-151-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 30 mm thermal heat sink with an L-Tab (T412) design.

The ATS-18C-11-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-177-C3-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×20 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-88-C3-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-85-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-18C-171-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink (R-TAB, T412) measuring 30 x 30 x 20 mm.

The ATS-18C-105-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-18C-83-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 30×30×30 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-127-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-18C-184-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 40 x 40 x 25 mm, for assorted BGA, LGA, CPU and ASIC applications (T766).

The ATS-18C-127-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-191-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-182-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 15 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-18C-89-C2-R0 from Advanced Thermal Solutions Inc. is an R-Tab heat sink measuring 35 x 35 x 30 mm, designated T766.

The ATS-18C-184-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×25 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-35-C1-R0 from Advanced Thermal Solutions Inc. is a 36.83 x 57.6 x 5.84 mm aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-18C-20-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×25 mm, XCUT, with T766 designation, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-152-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 35 mm with an L-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-18C-93-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 20 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-18C-50-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-18C-111-C2-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-18C-77-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 25×25×30 mm with an R-tab, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-173-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 30×30×30 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-164-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 45×45×35 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-18C-31-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with T766 designation.

The ATS-18C-74-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-18C-38-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83×57.6×22.86 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-51-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 30 x 30 x 20 mm.

The ATS-18C-154-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 40×40×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-121-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-185-C2-R0 from Advanced Thermal Solutions Inc. is a 40×40×30 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-183-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×20 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-18C-194-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm heat sink (XCUT).

The ATS-18C-19-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-194-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-116-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-18C-167-C1-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 25×25×20 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-18C-207-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with XCUT designation.

The ATS-18C-116-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×25 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.