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HAZ100

Brady Corporation
Low stock

HAZ100 from Brady Corporation is a (HAZ) HAZ100, PAD, 15""X19"", HVY,

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SM662PAD BFST

Silicon Motion, Inc.
Low stock

The SM662PAD BFST from Silicon Motion, Inc. is an eMMC NAND flash memory Integrated Circuit (TLC) with 1 Tbit capacity in a 153-BGA (11.5x13) package.

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B31-WIPER

Brady Corporation
Low stock

The B31-WIPER from Brady Corporation is a media wiper pad for B30 printers (1=5PCS).

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EL-ENVIROPAD-TC

Lascar Electronics
Low stock

EL-ENVIROPAD-TC from Lascar Electronics is a DATA LOG AND DISPLAY TEMP PRO

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BPADAPT23

Tripp Lite
Low stock

BPADAPT23 from Tripp Lite is a EXTERNAL BATTERY PACK

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BO-BOX-0

Automation Components, Inc.
Low stock

BO-BOX-0 from Automation Components, Inc. is a 4 Channel Relay Output Module, Q

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B002-DUA2

Tripp Lite
Low stock

The B002-DUA2 from Tripp Lite is a 2-port secure KVM switch with DVI and USB connections.

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4169G

Aavid, Thermal Division of Boyd Corporation
Low stock

4169G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 19.3MMX13.97MM

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HSP-5

Sensata-Crydom
Low stock

HSP-5 from Sensata-Crydom is a THERM PAD 104.39MMX73.66MM W/ADH

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HANDYSORB-BASICPAD

Brady Corporation
Low stock

HANDYSORB-BASICPAD from Brady Corporation is a (KIT) HANDYSORB UNI PAD REFILL W

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5300 1.500G

Aavid, Thermal Division of Boyd Corporation
In stock

5300 1.500G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 100MX38.1MM GRAY/GREEN

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53-77-4G

Aavid, Thermal Division of Boyd Corporation
Low stock

53-77-4G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 19.05MMX12.7MM GRY/GRN

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A/TT100-BO-2

Automation Components, Inc.
Low stock

A/TT100-BO-2 from Automation Components, Inc. is a Transmitter w/ 100 Ohm RTD, Boar

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188623F00000G

Aavid, Thermal Division of Boyd Corporation
In stock

188623F00000G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 40.46X27.94MM GRAY

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56-02-101G

Aavid, Thermal Division of Boyd Corporation
In stock

56-02-101G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 26.16MMX22.61MM OPAQUE

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189735F00000G

Aavid, Thermal Division of Boyd Corporation
In stock

189735F00000G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 18.03MMX12.7MM W/ADH

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BS75K-160-160-4.0

Shiu Li Technology Co., Ltd.
Low stock

BS75K-160-160-4.0 from Shiu Li Technology Co., Ltd. is a THERM PAD 160MMX160MM GRAY

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BPH200

Brady Corporation
Low stock

BPH200 from Brady Corporation is a (BSC-CH) BPH200 PAD, 15""X17"" LGT

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BS75K-320-320-3.5

Shiu Li Technology Co., Ltd.
Low stock

BS75K-320-320-3.5 from Shiu Li Technology Co., Ltd. is a THERM PAD 320X320MM GRAY

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BS75K-320-320-2.0

Shiu Li Technology Co., Ltd.
Low stock

BS75K-320-320-2.0 from Shiu Li Technology Co., Ltd. is a THERM PAD 320X320MM GRAY

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BS87-160-160-1.0

Shiu Li Technology Co., Ltd.
Low stock

BS87-160-160-1.0 from Shiu Li Technology Co., Ltd. is a THERM PAD 160MMX160MM GRAY

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BS75K-320-320-2.5

Shiu Li Technology Co., Ltd.
Low stock

BS75K-320-320-2.5 from Shiu Li Technology Co., Ltd. is a THERM PAD 320X320MM GRAY

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4003G

Aavid, Thermal Division of Boyd Corporation
Low stock

4003G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 39.65X26.67MM WHT

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IR-1900-FOAM-PAD-SET

TE Connectivity AMP Connectors
Low stock

IR-1900-FOAM-PAD-SET from TE Connectivity AMP Connectors is a UPPER RAIL BACKING PAD

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TP01-M

Sensata-Crydom
Low stock

TP01-M from Sensata-Crydom is a THERM PAD 55.12X42.42MM W/ADH

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TP-GP01-S-A

Gelid Solutions LLC
Low stock

TP-GP01-S-A from Gelid Solutions LLC is a GP-EXTREME 120 X 120, 0.5MM

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BOS1901CQT

Boreas Technologies
Low stock

The BOS1901CQT from Boreas Technologies is a piezo haptic driver PMIC for keyboards and mice, mobile phones/tablets and portable computers, in a 20-QFN (4x4) package.

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BS75K-160-160-3.0

Shiu Li Technology Co., Ltd.
Low stock

BS75K-160-160-3.0 from Shiu Li Technology Co., Ltd. is a THERM PAD 160MMX160MM GRAY

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HSP-1

Sensata-Crydom
Low stock

HSP-1 from Sensata-Crydom is a THERM PAD 57.15X44.45MM WHT

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913R7M-BOO

MACOM Technology Solutions
Low stock

913R7M-BOO from MACOM Technology Solutions is a CAPACITOR CHIP, BINARY 4 PAD CHI

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SE56,BK

Serpac
Low stock

SE56,BK from Serpac is a MICRO CASE W/PADDED LINER AND PL

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PA0192-S

Chip Quik Inc.
Low stock

PA0192-S from Chip Quik Inc. is a TSSOP-14-EXP-PAD STENCIL

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56-77-10G

Aavid, Thermal Division of Boyd Corporation
In stock

56-77-10G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 5.2MM DIA OPAQUE

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SOFTFLEX-B016-20-01-0762-0762

Aavid, Thermal Division of Boyd Corporation
In stock

SOFTFLEX-B016-20-01-0762-0762 from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 76.2X76.2MM W/ADH

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LPD-SOM-CLIP2-THPAD

Beacon EmbeddedWorks
Low stock

The LPD-SOM-CLIP2-THPAD from Beacon EmbeddedWorks is a torpedo thermal pad for SOM-M1 and SOM-M2 modules.

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SOFTFLEX-D021-20-01-0762-0762

Aavid, Thermal Division of Boyd Corporation
In stock

SOFTFLEX-D021-20-01-0762-0762 from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 76.2X76.2MM W/ADH PINK

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BS87-320-320-1.0

Shiu Li Technology Co., Ltd.
Low stock

BS87-320-320-1.0 from Shiu Li Technology Co., Ltd. is a THERM PAD 320X320MM GRAY

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BS87-160-160-3.0

Shiu Li Technology Co., Ltd.
Low stock

BS87-160-160-3.0 from Shiu Li Technology Co., Ltd. is a THERM PAD 160MMX160MM GRAY

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46-77-9G

Aavid, Thermal Division of Boyd Corporation
In stock

46-77-9G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 18.42MMX13.21MM AMBER

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53-77-9G

Aavid, Thermal Division of Boyd Corporation
Low stock

53-77-9G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 18.42X13.21MM GRY/GRN

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MXP-C20

Brady Corporation
Low stock

MXP-C20 from Brady Corporation is a (KIT) MXP-C20, 20 PAD CHEMICAL M

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53-77-4ACG

Aavid, Thermal Division of Boyd Corporation
Low stock

53-77-4ACG from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 19.05X12.7MM W/ADH

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SOFTFLEX-E038-20-02-4000-2000

Aavid, Thermal Division of Boyd Corporation
In stock

SOFTFLEX-E038-20-02-4000-2000 from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 400X200MM W/ADH GRAY

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56-03-8G

Aavid, Thermal Division of Boyd Corporation
Low stock

56-03-8G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 42.85X30.15MM OPAQUE

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HSP-7

Sensata-Crydom
Low stock

HSP-7 from Sensata-Crydom is a THERM PAD 39.4X17MM PINK

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56-02-10G

Aavid, Thermal Division of Boyd Corporation
In stock

56-02-10G from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 5.2MM DIA OPAQUE

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53-77-13ACG

Aavid, Thermal Division of Boyd Corporation
In stock

53-77-13ACG from Aavid, Thermal Division of Boyd Corporation is a THERM PAD 18.03X12.7MM W/ADH

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PAD1000YFFT

Texas Instruments
In stock

The PAD1000YFFT from Texas Instruments is a DLP DMD analog ASIC.

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