Search results for “ATS-20F”

The ATS-20F-127-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-198-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 12 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-20F-80-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×15 mm, with an R-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-177-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 20 mm with an R-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-20F-07-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-79-C2-R0 from Advanced Thermal Solutions Inc. is a 30 mm x 30 mm x 10 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-20F-58-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20F-117-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-03-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 15 mm XCUT aluminum heat sink (T766) for top mounting.

The ATS-20F-180-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×35 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20F-197-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-154-C1-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 15 mm L-tab aluminum heat sink for top mounting.

The ATS-20F-81-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab heat sink measuring 30 x 30 x 20 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-20F-168-C1-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum R-tab heat sink for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-114-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices (XCUT T412).

The ATS-20F-122-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×15 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-118-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 15 mm XCUT heat sink.

The ATS-20F-82-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 25 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-20F-64-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×25 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-200-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20F-176-C2-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages (R-TAB T766).

The ATS-20F-186-C1-R0 from Advanced Thermal Solutions Inc. is a 40×40×35 mm aluminum heat sink with R-tab top mount, for BGA, LGA, CPU and ASIC packages.

The ATS-20F-181-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-20F-56-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35×35×15 mm with an L-tab (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-20F-185-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm, with an R-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-10-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT heat sink measuring 45 x 45 x 25 mm.

The ATS-20F-55-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm aluminum top-mount heat sink with L-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-13-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×15 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-172-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 25 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-20F-75-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-20F-197-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-06-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-04-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×20 mm (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-20F-128-C1-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-20F-115-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20F-167-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-20F-165-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×10 mm R-tab aluminum heat sink (T412) with top mounting, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-58-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-20F-113-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-194-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-01-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-86-C1-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm aluminum heat sink with an R-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-20F-140-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×25 mm with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20F-51-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 30 x 30 x 20 mm.

The ATS-20F-91-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×10 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-20F-96-C1-R0 from Advanced Thermal Solutions Inc. is a 40×40×35 mm aluminum heat sink with R-tab top mount, for BGA, LGA, CPU and ASIC packages.

The ATS-20F-20-C1-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-20F-192-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 45×45×35 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.