Search results for “pushPIN”

The ATS-01E-47-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-10H-147-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 35 x 35 x 10 mm (T766).

The ATS-10G-11-C1-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 10 mm heat sink (XCUT).

The ATS-04D-105-C2-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-09D-105-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-09E-02-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x12.7 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-16E-43-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-21F-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The 0936010257 from Molex is a gray female insert (S-EP) with 16+ground positions and push-in termination.

The ATS-06C-163-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 30 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-04C-193-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40 x 40 x 6 mm (XCUT T412), for BGA, LGA, CPU and ASIC devices.

The ATS-01H-57-C1-R0 from Advanced Thermal Solutions Inc. is a 35×35×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-21H-111-C3-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-05A-161-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 45×45×20 mm with an L-tab profile and T412 designation.

The ATS-21E-130-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 60 mm × 60 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-02F-161-C2-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm heat sink, L-TAB T766.

The ATS-15C-21-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-04A-12-C1-R0 from Advanced Thermal Solutions Inc. is a 50×50×12.7 mm aluminum top-mount heat sink for assorted devices including BGA, LGA, CPU and ASIC packages.

The ATS-05E-161-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 20 mm L-TAB heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-21C-70-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 45 x 45 x 25 mm with an L-tab.

The ATS-05H-130-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 60 mm × 60 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-10B-161-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-07A-47-C1-R0 from Advanced Thermal Solutions Inc. is a 25×25×30 mm aluminum L-tab heat sink for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-07F-12-C1-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 12.7 mm XCUT heat sink.

The ATS-09F-130-C3-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 15 mm XCUT heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-02D-146-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×35 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-12A-12-C1-R0 from Advanced Thermal Solutions Inc. is a 50×50×12.7 mm aluminum top-mount heat sink for assorted devices including BGA, LGA, CPU and ASIC packages.

The 0936010311 from Molex is a gray male insert (S-EP) with 24 positions plus ground, for push-in terminations.

The ATS-17A-21-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-05C-115-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15H-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-16A-23-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-02B-47-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The 0936010261 from Molex is a gray male push-in heavy duty insert with 16 + ground positions.

The ATS-CPX040040010-194-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC packages, measuring 40 × 40 × 10 mm.

The ATS-06H-107-C3-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-04H-44-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 25×25×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-01H-115-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 40x40x20 mm with an XCUT style (T412).

The ATS-05A-130-C3-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 15 mm XCUT heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-110-C1-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-07F-159-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45 × 45 × 10 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-11E-123-C1-R0 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm × 20 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-12G-60-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 35 mm with an L-TAB design, assorted for BGA, LGA, CPU and ASIC devices.