Search results for “ate”

The ATS-CHILL600V from Advanced Thermal Solutions Inc. is an active recirculating chiller rated 600 W, operating at 120/220 VAC with a flow of 3.96 GPM (15.0 LPM).

The ATS-01E-07-C2-R0 from Advanced Thermal Solutions Inc. is an assorted-use aluminum heat sink measuring 45×45×12.7 mm, for BGA, LGA, CPU and ASIC devices, with a top-mount design.

The ATS-12F-112-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-HP-F6L150S26W-241 from Advanced Thermal Solutions Inc. is a flat heat pipe rated 26 W, measuring 8.6 x 2 x 150 mm.

The ATS-02A-16-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 54×54×10 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-05C-128-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 54×54×25 mm with an X-cut profile and T412 designation.

The ATS-16E-158-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 35 mm aluminum top-mount heat sink with L-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-14H-184-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×25 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15C-122-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 50×50×15 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-09C-137-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×10 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-09H-175-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-12F-153-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-15A-195-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×12 mm, XCUT, with T412 designation, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13B-193-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40 x 40 x 6 mm (XCUT T412), for BGA, LGA, CPU and ASIC devices.

The ATS-14H-194-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-51290K-C1-R0 from Advanced Thermal Solutions Inc. is a 29 x 29 x 14.5 mm aluminum top-mount heat sink for BGA devices.

The ATS-13B-201-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 x 50 x 12 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-02F-181-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-17F-174-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 30×30×35 mm with an R-tab profile and T412 designation.

The ATS-18H-148-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35×35×15 mm with an L-tab (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-PPS-14 from Advanced Thermal Solutions Inc. is a stainless steel spring for pushPIN heat sinks, 4.47 mm.

The ATS-02C-175-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×10 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-12H-169-C1-R0 from Advanced Thermal Solutions Inc. is a 30 mm × 30 mm × 10 mm heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages, made of aluminum and mounted on top.

The ATS-10B-198-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45 mm x 45 mm x 12 mm.

The ATS-02H-148-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm L-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-05F-144-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 x 30 x 25 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-12D-198-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45 mm x 45 mm x 12 mm.

The ATS-13B-117-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 45 mm × 45 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-20G-201-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50×50×12 mm, with an XCUT T412 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-15F-108-C1-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-04G-188-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-14B-170-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab heat sink measuring 30 x 30 x 15 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-17C-151-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×30 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-02G-183-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 20 mm R-TAB heat sink (T412).

The ATS-16F-198-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 12 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-06G-198-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 12 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-P2-81-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 30 mm × 30 mm × 20 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-15E-160-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15B-207-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 60 x 60 x 12 mm (XCUT, T412).

The ATS-11B-103-C2-R1 from Advanced Thermal Solutions Inc. is a T766 heat sink measuring 40 x 40 x 9.5 mm with XCUT.

The ATS-12F-137-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03F-50-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 30×30×15 mm with an L-tab mounting style (T766).

The ATS-11H-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-18F-204-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 54 x 54 x 12 mm (XCUT).

The ATS-12A-183-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×20 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08C-153-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 40×40×10 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-08G-191-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.