Search results for “XStream™”

The ATS-21C-23-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-17G-23-C3-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 15 mm XCUT heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-12E-07-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 45×45×12.7 mm, XCUT T412.

The ATS-03C-15-C3-R0 from Advanced Thermal Solutions Inc. is a 50×50×25 mm cross-cut (XCUT) aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-14G-01-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm heat sink (XCUT).

The ATS-01C-11-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×10 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-21F-03-C2-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm heat sink (XCUT T766).

The ATS-02D-132-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-03-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices (XCUT T412).

The ATS-21F-126-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-04E-206-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-13B-103-C3-R1 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 40 mm × 40 mm × 9.5 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-01A-07-C3-R0 from Advanced Thermal Solutions Inc. is an assorted-application aluminum heat sink (for BGA, LGA, CPU, ASIC and similar devices) measuring 45x45x12.7 mm, with top mount and XCUT (T412) design.

The ATS-02A-15-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-02B-06-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-02F-119-C2-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-16G-05-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×25 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-17A-206-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 × 60 × 10 mm (XCUT), for BGA, LGA, CPU and ASIC devices.

The ATS-04E-15-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-21C-03-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 40 x 40 x 15 mm, with XCUT and T412 codes.

The ATS-21F-03-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices (XCUT T412).

The ATS-18E-206-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 × 60 × 10 mm (XCUT), for BGA, LGA, CPU and ASIC devices.

The ATS-21D-15-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-21C-122-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 50×50×15 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-17C-01-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm heat sink (XCUT).

The ATS-19F-13-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×15 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-21F-17-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×12.7 mm, XCUT, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-01E-128-C1-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-04H-04-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×20 mm (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-02B-07-C3-R0 from Advanced Thermal Solutions Inc. is an assorted-application aluminum heat sink (for BGA, LGA, CPU, ASIC and similar devices) measuring 45x45x12.7 mm, with top mount and XCUT (T412) design.

The ATS-13E-07-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 12.7 mm heat sink (T766, XCUT).

The ATS-16G-06-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-19G-04-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×20 mm (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-19E-119-C2-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-18G-122-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 50×50×15 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-19E-04-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 40x40x20 mm with an XCUT style (T412).

The ATS-19A-15-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 mm × 50 mm × 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-02F-205-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 6 mm XCUT aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-04E-113-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm heat sink (XCUT).

The ATS-17A-121-C1-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 10 mm heat sink (XCUT).

The ATS-21D-193-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40x40x6 mm.

The ATS-01B-198-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 12 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-02C-10-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-21G-115-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×20 mm (T766), for BGA, LGA, CPU and ASIC devices.

The XRP6124ESTR0.5-F from MaxLinear, Inc. is a positive-output step-down buck DC-DC controller Integrated Circuit in a SOT-23-5 package.

The ATS-04A-197-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 45 mm × 45 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-01B-114-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices (XCUT T412).

The ATS-02D-114-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×15 mm with an X-cut profile.