Search results for “65LVCP22”

The SN65LVCP22DR from Texas Instruments is a crosspoint switch Integrated Circuit with a 1 x 2:2 configuration, in a 16-SOIC package.

The SN65LVCP22DG4 from Texas Instruments is a 1 x 2:2 crosspoint switch Integrated Circuit in a 16-SOIC package.

The SN65LVCP22PWR from Texas Instruments is a crosspoint switch Integrated Circuit with a 1 x 2:2 configuration, in a 16-TSSOP package.

The SN65LVCP22PW from Texas Instruments is a crosspoint switch Integrated Circuit with a 1 x 2:2 configuration in a 16-TSSOP package.

The SN65LVCP22D from Texas Instruments is a crosspoint switch Integrated Circuit with a 1 x 2:2 configuration in a 16-SOIC package.

SN65LVCP22PWG4 from Texas Instruments is a Integrated Circuit 2x2 crosspoint switch : LVDS outputs - LVDS, M-LVDS & PECL ICs. The SN65LVCP22 is a 2x2 crosspoint switch providing greater than 1000 Mbps operation for each path. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVDS drivers to provide low-power, low-EMI, high-speed operation. The SN65LVCP22 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2x2 switching, and LVPECL/CML to LVDS level translation on each channel. The flexible operation of the SN65LVCP22 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers additional gigibit repeater/translator and crosspoint products in the SN65LVDS100 and SN65LVDS122. The SN65LVCP22 uses a fully differential data path to ensure low-noise generation, fast switching times, low pulse width distortion, and low jitter. Output channel-to-channel skew is less than 10 ps (typ) and 50 ps (max) to ensure accurate alignment of outputs in all applications. Both SOIC and TSSOP package options are available to allow easy upgrade for existing solutions, and board area savings where space is critical.