Search results for “Adaptec®”

2275200-R from Microchip Technology is a ADAPTEC ACK-I-MSASX4-MSASX4-1M

2274200-R from Microchip Technology is a ADAPTEC RAID 7805 KIT

2231700-R from Microchip Technology is a ADAPTEC I-MSASX4-SASX4-0.5M R

2274100-R from Microchip Technology is a ADAPTEC RAID 7805 SINGLE

2270000-R from Microchip Technology is a ADAPTEC RAID 6405 SINGLE

2271800-R from Microchip Technology is a ADAPTEC RAID 6805E KIT

2274900-R from Microchip Technology is a ADAPTEC RAID 72405 SINGLE

2274400-R from Microchip Technology is a ADAPTEC RAID 71605 SINGLE

2279800-R from Microchip Technology is a ADAPTEC I-HDMSAS-4SATA-SB.8M

2280200-R from Microchip Technology is a ADAPTEC I-RA-HDMSAS-MSAS-.8M

96RC-SAS-4P-PE-AD4 from Advantech Corp is a ADAPTEC 8405E SAS 4P 12GB/S 512M

2281300-R from Microchip Technology is a ADAPTEC I-RA-HDMSAS-MSAS-.5M

2275400-R from Microchip Technology is a ADAPTEC FLASH MODULE SUPERCAP 70

2275300-R from Microchip Technology is a ADAPTEC I-MSASX4-SAS-SB-0.7M

2246800-R from Microchip Technology is a ADAPTEC I-MSASX4-MSASX4-0.5M R

2272300-R from Microsemi Corporation is a ADAPTEC I-MSASX4-4SATAX1-SB-0.7M

2231400-R from Microchip Technology is a ADAPTEC E-MSASX4-MSASX4-1M R DAT

2247100-R from Microchip Technology is a ADAPTEC I-MSASX4-4SATAX1-SB-1M R

2281200-R from Microchip Technology is a ADAPTEC I-HDMSAS-MSAS-.5M

2293800-R from Microchip Technology is a HBA 1100-24I2B SINGLE

TSSOP-VSSOP-ADAPTE from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

IP65 ADAPTER SET from Fluke Electronics is a FLUKE-174X POWER QUALITY LOGGER

SOIC-ADAPTER-EVM from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

OPTI-ADAPTER from Panduit Corp is a OPTICOM CASSETTE AND FAP ADAPTER

D-SOIC-ADAPTER-EVM from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

NA5-7W-ADAPTER-NS8 from Omron Automation and Safety is a NA5-7W FROM NS8 ADAPTER PLATE

NA5-12W-ADAPTER-NS10-NS12 from Omron Automation and Safety is a NA5-12W FROM NS10/NS12 ADAPTER