Search results for “Adaptec HBA”

2293800-R from Microchip Technology is a HBA 1100-24I2B SINGLE

2280200-R from Microchip Technology is a ADAPTEC I-RA-HDMSAS-MSAS-.8M

2231700-R from Microchip Technology is a ADAPTEC I-MSASX4-SASX4-0.5M R

LPE1250-AP from Broadcom Limited is a HBA FC SGL PORT EMULEX 8GB

2274200-R from Microchip Technology is a ADAPTEC RAID 7805 KIT

2275200-R from Microchip Technology is a ADAPTEC ACK-I-MSASX4-MSASX4-1M

2275300-R from Microchip Technology is a ADAPTEC I-MSASX4-SAS-SB-0.7M

2279800-R from Microchip Technology is a ADAPTEC I-HDMSAS-4SATA-SB.8M

2281200-R from Microchip Technology is a ADAPTEC I-HDMSAS-MSAS-.5M

2281300-R from Microchip Technology is a ADAPTEC I-RA-HDMSAS-MSAS-.5M

2272300-R from Microsemi Corporation is a ADAPTEC I-MSASX4-4SATAX1-SB-0.7M

2293700-R from Microchip Technology is a HBA 1100-8I8E SINGLE

2293500-R from Microchip Technology is a HBA 1100-16I SINGLE

2246800-R from Microchip Technology is a ADAPTEC I-MSASX4-MSASX4-0.5M R

TSSOP-VSSOP-ADAPTE from Texas Instruments is a Evaluation module to convert between different amplifier and comparator packages. The SURFACE-MOUNT-ADAPTER-EVM provides engineers with the ability to test new, smaller amplifier and comparator packages without needing to spin their existing circuit board. This evaluation module (EVM) converts the most popular small packages into familiar, larger footprints like SOIC, TSSOP and VSSOP in 8-pin, 14-pin and 16-pin footprints. This enables engineers to save time and effort by helping verify that a device will achieve their design goals before needing to make adjustments to the printed circuit board (PCB) layout. Once design evaluation is complete, engineers can use this EVM as a reference to implement a dual-footprint layout that accepts both the larger and smaller package, or they can reduce the PCB size by optimizing the layout for the smaller package. The SURFACE-MOUNT-ADAPTER-EVM is available in four different options: D-SOIC-ADAPTER-EVM converts the following packages to the SOIC-14 or SOIC-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM), WSON-8 (DSG) and SOT-23-8 (DCN/DDF). QUAD-TSSOP-ADAPTER converts the following packages to the TSSOP-14 or TSSOP-16 footprint: WQFN-16 (RTE), X2QFN-10 (RUG), SOT-23-14 (DYY), X2QFN-14 (RUC), WQFN-16 (RUM) and WSON-8 (DSG). SOIC-ADAPTER-EVM converts the following packages to the SOIC-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DRG/DSG), SOT-23-5/6 (DBV), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). TSSOP-VSSOP-ADAPTE converts the following packages to the TSSOP-8 or VSSOP-8 footprint: SOT-23-8 (DCN/DDF), X2QFN-10 (RUG), WSON-8 (DSG), SC70-5/6 (DCK), X2SON-5 (DPW), SOT-5x3-5/6 (DRL) and WSON-6 (DSE). Features Choose from four different boards Verify the circuit works as needed using the existing PCB, before adjusting the layout for the smaller package Reference the EVM to enable a dual package footprint for increased multisourcing capability Optimized PCB designed to reduce parasitics

2247100-R from Microchip Technology is a ADAPTEC I-MSASX4-4SATAX1-SB-1M R

96FMCF-ST3ADAPTER from Advantech Corp is a ADDONICS 3.5"" CF ADAPTER SATA BO

96RC-SAS-4P-PE-AD4 from Advantech Corp is a ADAPTEC 8405E SAS 4P 12GB/S 512M

2231400-R from Microchip Technology is a ADAPTEC E-MSASX4-MSASX4-1M R DAT