Search results for “ats-03e”

The ATS-03E-39-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages, measuring 57.9 x 60.96 x 5.84 mm.

The ATS-03E-201-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 x 50 x 12 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-03E-196-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 6 mm cross-cut aluminum heat sink with top mounting, suited to BGA, LGA, CPU and ASIC devices (T766).

The ATS-03E-150-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-85-C1-R0 from Advanced Thermal Solutions Inc. is a 35×35×10 mm aluminum top-mount heat sink with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-43-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×10 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-85-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×10 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-100-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×25 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-194-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-191-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-198-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45 mm x 45 mm x 12 mm.

The ATS-03E-88-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-203-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-87-C3-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×20 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-35-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83×57.6×5.84 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-58-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-32-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 11.43 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-191-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×30 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-116-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-191-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-100-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 25 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03E-13-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×15 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-37-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 17.78 mm (T766).

The ATS-03E-03-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×15 mm with an X-cut profile.

The ATS-03E-190-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×25 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-95-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×30 mm with an R-tab profile and T412 designation.

The ATS-03E-85-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03E-81-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 30 mm × 30 mm × 20 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-03E-53-C3-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 30 mm L-tab heat sink (T412).

The ATS-03E-53-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×30 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-198-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45×45×12 mm.

The ATS-03E-97-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-140-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum L-tab heat sink with a T766 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-140-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum top-mount heat sink with an L-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-209-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-33-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 × 36.83 × 17.78 mm (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-03E-199-C3-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 6 mm heat sink (XCUT, T412).

The ATS-03E-35-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83 x 57.6 x 5.84 mm (T412), for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03E-99-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-03E-192-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 35 mm R-TAB aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03E-100-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 25 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03E-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03E-183-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×20 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03E-77-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×30 mm R-tab aluminum heat sink (T412) with top mounting, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-95-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm, with an R-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-190-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 25 mm R-tab heat sink.

The ATS-03E-77-C2-R0 from Advanced Thermal Solutions Inc. is a 25×25×30 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.