Search results for “vinculum-ii”

The VNC2-48Q1C-REEL from FTDI, Future Technology Devices International Ltd is a USB controller with USB 2.0 and SPI, UART interfaces, in a 48-QFN (8x8) package.

The VNC2-64Q1C-TRAY from FTDI, Future Technology Devices International Ltd is a USB Vinculum-II host/device controller.

The VNC2-64Q1C-REEL from FTDI, Future Technology Devices International Ltd is a USB 2.0 host/device controller with SPI and UART interfaces, in a 64-QFN (8x8) package.

The VNC2-48Q1C-TRAY from FTDI, Future Technology Devices International Ltd is a USB 2.0 host/device controller with SPI and UART interfaces, in a 48-QFN (8x8) package.

The VNC2-48L1C-TRAY from FTDI, Future Technology Devices International Ltd is a USB 2.0 controller Integrated Circuit with SPI and UART interfaces, in a 48-LQFP (7x7) package.

The VNC2-64L1C-REEL from FTDI, Future Technology Devices International Ltd is a USB host/device controller with USB 2.0, SPI and UART interfaces, in a 64-LQFP (10x10) package.

The VNC2-64Q1B-TRAY from FTDI, Future Technology Devices International Ltd is a USB host/device controller Integrated Circuit in a 64-QFN package.

VNC2-64Q1B-REEL from FTDI, Future Technology Devices International Ltd is a IC USB HOST/DEVICE CTRL 64-QFN

The VNC2-32L1B-REEL from FTDI, Future Technology Devices International Ltd is a USB host/device controller Integrated Circuit, in a 32-LQFP package.

The VNC2-32Q1C-REEL from FTDI, Future Technology Devices International Ltd is a USB 2.0 host/device controller with SPI and UART interfaces, in a 32-QFN (7x7) package.

The VNC2-48Q1B-REEL from FTDI, Future Technology Devices International Ltd is a USB controller supporting USB 2.0 with SPI and UART interfaces, in a 48-QFN (8x8) package.

The VNC2-32Q1B-REEL from FTDI, Future Technology Devices International Ltd is a USB controller with USB 2.0 and SPI and UART interfaces in a 32-QFN (7x7) package.

The VNC2-32Q1B-TRAY from FTDI, Future Technology Devices International Ltd is a USB controller with USB 2.0 and SPI/UART interfaces, in a 32-QFN (7x7) package.

VNC2-48Q1B-TRAY from FTDI, Future Technology Devices International Ltd is a IC USB HOST/DEVICE CTRL 48-QFN

The VNC2-64L1B-REEL from FTDI, Future Technology Devices International Ltd is a USB host/device controller with USB 2.0, SPI and UART interfaces, in a 64-LQFP (10x10) package.

The VNC2-64L1B-TRAY from FTDI, Future Technology Devices International Ltd is a USB host/device controller Integrated Circuit in a 64-LQFP package.

The VNC2-48L1C-REEL from FTDI, Future Technology Devices International Ltd is a USB controller Integrated Circuit with USB 2.0 and SPI, UART interfaces, in a 48-LQFP (7x7) package.

The VNC2-32L1C-REEL from FTDI, Future Technology Devices International Ltd is a USB 2.0 controller with SPI and UART interfaces, in a 32-LQFP (7x7) package.

The VNC2-32Q1C-TRAY from FTDI, Future Technology Devices International Ltd is a USB 2.0 host/device controller with SPI and UART interfaces, in a 32-QFN (7x7) package.

The VNC2-32L1B-TRAY from FTDI, Future Technology Devices International Ltd is a USB host/device controller with USB 2.0, SPI and UART interfaces, in a 32-LQFP (7x7) package.

The VNC2-64L1C-TRAY from FTDI, Future Technology Devices International Ltd is a USB host/device controller supporting USB 2.0 with SPI and UART interfaces, in a 64-LQFP (10x10) package.

The VNC2-48L1B-TRAY from FTDI, Future Technology Devices International Ltd is a USB 2.0 controller Integrated Circuit with SPI and UART interfaces, in a 48-LQFP (7x7) package.

VMUSIC3 from FTDI, Future Technology Devices International Ltd is a MOD USB AUDIO FLASH DRIVE I/F

The VNC2-32L1C-TRAY from FTDI, Future Technology Devices International Ltd is a USB host/device controller Integrated Circuit in a 32-LQFP package.

2636990000 from Weidmuller is a VPU AC II 1 75/50

2730720000 from Weidmuller is a VPU AC II US 3 400/50

The W9864G2JH-6I from Winbond Electronics is a 64Mbit SDRAM memory Integrated Circuit with LVTTL interface at 166 MHz and 5 ns, in an 86-TSOP II package.

The W9816G6JH-6 from Winbond Electronics is an SDRAM memory Integrated Circuit with a 16Mbit parallel interface, 166 MHz, 5 ns, and a 50-TSOP II package.

VL-EPMP-34E from VersaLogic Corporation is a SBC CORE II DUO 1.2 GHZ MAX 4GB

VDRIVE3 from FTDI, Future Technology Devices International Ltd is a MOD USB FLASH DRIVE INTERFACE

VDRIVE3-LD from FTDI, Future Technology Devices International Ltd is a MOD USB FLASH DRV INTRFACE W/LID

2730570000 from Weidmuller is a VPU AC II US 1 277/50

The XC2V3000-4FG676C from AMD is a Virtex-II Field Programmable Gate Array (FPGA) Integrated Circuit with 484 I/O, value 1769472, in a 676-BGA package.

The W9812G6IH-6 from Winbond Electronics is a 128 Mbit parallel DRAM Integrated Circuit in a 54-TSOP II package.

The VNS3NV04P-E from STMicroelectronics is an OMNIFET II power switch/driver Integrated Circuit rated at 3.5 A in an 8-SOIC package.

The W9812G6KH-5 from Winbond Electronics is a 128Mbit parallel SDRAM memory Integrated Circuit with a 200 MHz clock and 4.5 ns timing, in a 54-TSOP II package.

The MPC8313VRADDC from NXP USA Inc. is a PowerQUICC II Pro microprocessor Integrated Circuit in a 516-TEPBGA (27x27) package.

The W9412G6KH-5 from Winbond Electronics is a DDR SDRAM memory Integrated Circuit with 128 Mbit capacity, a parallel interface, 200 MHz clock rate, 50 ns access time, and a 66-TSOP II package.

The EP2S130F1508C3 from Intel is a Stratix II field-programmable gate array (FPGA) Integrated Circuit with 1126 I/O in a 1508-BBGA, FCBGA package, with unlabeled values 6747840 and 132540.