Search results for “ATS-13D”

The ATS-13D-45-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 25 mm × 25 mm × 20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-30-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink measuring 70 x 70 x 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13D-116-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-178-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (R-TAB, T766) measuring 35 x 35 x 25 mm.

The ATS-13D-68-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-29-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-161-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 45×45×20 mm with an L-tab profile and T412 designation.

The ATS-13D-41-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 60.96 x 17.78 mm, suited to assorted BGA, LGA, CPU and ASIC packages.

The ATS-13D-159-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45 x 45 x 10 mm with an L-tab (T766), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-13D-180-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×35 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-06-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-146-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 × 30 × 35 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-13D-188-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-60-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 35 mm with an L-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-13D-208-C1-R0 from Advanced Thermal Solutions Inc. is an X-cut heat sink measuring 70 x 70 x 6 mm.

The ATS-13D-210-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 x 70 x 12 mm (XCUT), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-13D-109-C3-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-115-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-203-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 54×54×10 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-55-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm aluminum top-mount heat sink with L-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-178-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-170-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab heat sink measuring 30 x 30 x 15 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13D-194-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-60-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 35 mm, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-03-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices (XCUT T412).

The ATS-13D-160-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm L-tab heat sink.

The ATS-13D-69-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-36-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 36.83×57.6×11.43 mm, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-13D-99-C1-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 45x45x20 mm with an R-tab mounting style.

The ATS-13D-147-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 35 x 35 x 10 mm (T766).

The ATS-13D-14-C3-R0 from Advanced Thermal Solutions Inc. is a 50×50×20 mm top-mount aluminum heat sink (T412) for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-68-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm L-tab heat sink.

The ATS-13D-19-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 20 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-166-C3-R0 from Advanced Thermal Solutions Inc. is an R-TAB heat sink measuring 25 x 25 x 15 mm (T412).

The ATS-13D-66-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 35 mm aluminum top-mount heat sink with L-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-158-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (L-TAB, T766) measuring 40 x 40 x 35 mm.

The ATS-13D-45-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 25x25x20 mm with an L-tab mounting style (T766).

The ATS-13D-136-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT heat sink measuring 70 x 70 x 25 mm.

The ATS-13D-07-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 12.7 mm heat sink (T766, XCUT).

The ATS-13D-69-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 20 mm L-TAB heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-69-C3-R0 from Advanced Thermal Solutions Inc. is an L-TAB heat sink measuring 45 x 45 x 20 mm (T412).

The ATS-13D-95-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm, with an R-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-89-C3-R0 from Advanced Thermal Solutions Inc. is a 35 mm × 35 mm × 30 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-08-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-10-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages (XCUT T766).

The ATS-13D-119-C2-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13D-28-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×15 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.