Search results for “ATS-13D”

The ATS-13D-09-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-134-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×15 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-68-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm L-TAB (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-10-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-158-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 35 mm aluminum top-mount heat sink with L-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-126-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×15 mm, with an XCUT designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-161-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 20 mm L-TAB heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-06-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-92-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×15 mm with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-147-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm aluminum top-mount heat sink with L-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-110-C1-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-129-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-13D-45-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×20 mm with an L-tab and T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-36-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 11.43 mm (T412).

The ATS-13D-29-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×20 mm with an XCUT T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-118-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 45×45×15 mm with an X-cut profile and T412 designation.

The ATS-13D-22-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-62-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 40×40×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-27-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×12.7 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-129-C3-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 10 mm heat sink with XCUT (T412).

The ATS-13D-210-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount XCUT T412 heat sink measuring 70 x 70 x 12 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13D-62-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 15 mm L-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13D-180-C3-R0 from Advanced Thermal Solutions Inc. is an R-TAB heat sink measuring 35 x 35 x 35 mm (T412).

The ATS-13D-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-126-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-38-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83×57.6×22.86 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-10-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 45×45×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-27-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 mm × 70 mm × 12.7 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-13D-126-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm x 54 mm x 15 mm XCUT aluminum heat sink (T412) for top mounting.

The ATS-13D-98-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-160-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm L-TAB (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-163-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×30 mm with an L-tab (T412), intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-03-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 15 mm XCUT aluminum heat sink (T766) for top mounting.

The ATS-13D-163-C2-R0 from Advanced Thermal Solutions Inc. is a L-Tab heat sink measuring 45x45x30 mm, T766 series.

The ATS-13D-11-C1-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-44-C2-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 15 mm heat sink with an L-tab (T766).

The ATS-13D-119-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 20 mm aluminum top-mount heat sink with X-Cut R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-164-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 45 mm x 45 mm x 35 mm with an L-TAB.

The ATS-13D-42-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9×60.96×22.86 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-42-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 60.96 x 22.86 mm (T766), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-13D-38-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 22.86 mm (T766).

The ATS-13D-09-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 20 mm aluminum top-mount heat sink with X-Cut R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-13D-119-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13D-161-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-12-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50×50×12.7 mm (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-13D-18-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-118-C2-R0 from Advanced Thermal Solutions Inc. is an X-Cut heat sink measuring 45x45x15 mm, T766 series.

The ATS-13D-166-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.