Search results for “ATS-17E”

The ATS-17E-08-C2-R0 from Advanced Thermal Solutions Inc. is an X-Cut heat sink measuring 45x45x15 mm, T766 series.

The ATS-17E-109-C2-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-17E-106-C3-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-17E-31-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 36.83 x 5.84 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-17E-24-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 20 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-17E-26-C3-R0 from Advanced Thermal Solutions Inc. is a 70 x 70 x 10 mm XCUT T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-17E-83-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 30×30×30 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-17E-42-C3-R0 from Advanced Thermal Solutions Inc. is a 57.9 mm × 60.96 mm × 22.86 mm (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-17E-34-C2-R0 from Advanced Thermal Solutions Inc. is a 57.9×36.83×22.86 mm aluminum top-mount heat sink (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-186-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 35 mm R-tab heat sink (T412).

The ATS-17E-69-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 45×45×20 mm with an L-tab profile and T412 designation.

The ATS-17E-99-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-17E-19-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 20 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-17E-106-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-17E-206-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-17E-210-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 x 70 x 12 mm (XCUT), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-17E-90-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×35 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-19-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-17E-35-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83 x 57.6 x 5.84 mm (T412), for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-17E-60-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 35 mm with an L-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-17E-135-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×20 mm with an XCUT T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-08-C3-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm XCUT heat sink (T412).

The ATS-17E-126-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 54 x 54 x 15 mm, designated XCUT T766.

The ATS-17E-98-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-17E-188-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-17E-80-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×15 mm, with an R-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-17E-42-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9×60.96×22.86 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-17E-52-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30 x 30 x 25 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-17E-129-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-17E-23-C3-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 15 mm XCUT heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-109-C3-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-17E-42-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 60.96 x 22.86 mm (T766), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-17E-36-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83 x 57.6 x 11.43 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-17E-208-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 x 70 x 6 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-116-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-17E-34-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 57.9 x 36.83 x 22.86 mm.

The ATS-17E-192-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 45×45×35 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-17E-130-C3-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 15 mm XCUT heat sink (T412) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-195-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×12 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-17E-210-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount XCUT T412 heat sink measuring 70 x 70 x 12 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-17E-38-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 22.86 mm (T766).

The ATS-17E-110-C2-R1 from Advanced Thermal Solutions Inc. is an aluminum heat sink measuring 54.00 mm x 54.00 mm.

The ATS-17E-34-C3-R0 from Advanced Thermal Solutions Inc. is a T412 aluminum top-mount heat sink measuring 57.9 x 36.83 x 22.86 mm, suited to assorted components such as BGA, LGA, CPU and ASIC devices.

The ATS-17E-185-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×30 mm with an R-tab profile and T412 designation.

The ATS-17E-158-C3-R0 from Advanced Thermal Solutions Inc. is a 40 mm x 40 mm x 35 mm aluminum top-mount heat sink with L-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-17E-129-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-17E-196-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45 × 45 × 6 mm (XCUT), for BGA, LGA, CPU and ASIC devices.

The ATS-17E-38-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83×57.6×22.86 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.