Search results for “ATS-17E”

The ATS-17E-99-C1-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 45x45x20 mm with an R-tab mounting style.

The ATS-17E-12-C1-R0 from Advanced Thermal Solutions Inc. is a 50×50×12.7 mm aluminum top-mount heat sink for assorted devices including BGA, LGA, CPU and ASIC packages.

The ATS-17E-38-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 22.86 mm (T412).

The ATS-17E-36-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 36.83×57.6×11.43 mm, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-17E-36-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 11.43 mm (T412).

The ATS-17E-206-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The DSCA38-17E from DATAFORTH is a strain gage signal conditioner.

The AP.17E.07.0064A from Taoglas Limited is a 1.575 GHz ceramic patch antenna with an MHFI connector.

The LFXP2-17E-6QN208I from Lattice Semiconductor Corporation is an XP2 Field Programmable Gate Array (FPGA) Integrated Circuit with 146 I/O, figures 282624 and 17000, and a 208-BFQFP package.

The DSCA43-17E from DATAFORTH is a general-purpose signal conditioner.

RGP02-17E-E3/54 from Vishay General Semiconductor - Diodes Division is a DIODE GP 1.7KV 500MA DO204AL

The LFXP2-17E-5FN484I from Lattice Semiconductor Corporation is an XP2 FPGA Integrated Circuit (282624, 17000) with 358 I/O in a 484-BBGA package.

The 17E-1724-2 from Amphenol ICC (Commercial Products) is a two-piece, 9-position silver D-sub backshell with a 180° angle and unshielded design.

The 17E-1657-25 from Amphenol ICC (Commercial Products) is a 25-position two-piece silver D-Sub backshell with 180° orientation and shielding.

The LAXP2-17E-5QN208E from Lattice Semiconductor Corporation is an LA-XP2 FPGA Integrated Circuit with 146 I/O and additional figures 282624 and 17000, in a 208-BFQFP package.

The 17E-1727-2 from Amphenol ICC (Commercial Products) is a silver two-piece 37-position backshell with a 180° angle and unshielded construction.

The 17E-1725-2 from Amphenol ICC (Commercial Products) is a 15-position shielded D-sub backshell with a 180-degree orientation.

The LFXP2-17E-6FN484C from Lattice Semiconductor Corporation is an XP2 FPGA Integrated Circuit with 358 I/O, figures 282624 and 17000, in a 484-BBGA package.

The LFXP2-17E-6FN484I from Lattice Semiconductor Corporation is an XP2 FPGA Integrated Circuit with 358 I/O, the figures 282624 and 17000, in a 484-BBGA package.

The 17E-1726-1 from Amphenol ICC (Commercial Products) is a 25-position black two-piece backshell connector at 180°, unshielded.

The 17E-1727-1 from Amphenol ICC (Commercial Products) is a 37-position black two-piece backshell connector with a 180° unshielded design.

The LFXP2-17E-7QN208C from Lattice Semiconductor Corporation is an FPGA Integrated Circuit with 146 I/O, in a 208QFP package.

The 17E-1657-09 from Amphenol ICC (Commercial Products) is a silver two-piece 9-position D-Sub backshell with a 180° shielded design.

The 17E-1726-2 from Amphenol ICC (Commercial Products) is a silver two-piece 25-position backshell with a 180° angle and unshielded construction.

The LAXP2-17E-5FTN256E from Lattice Semiconductor Corporation is a LA-XP2 field programmable gate array (FPGA) Integrated Circuit with 201 I/O and figures 282624 and 17000, in a 256-LBGA package.

The 17E-1657-37 from Amphenol ICC (Commercial Products) is a 37-position two-piece silver shielded backshell (hood) for D-Sub connectors, with a 180° orientation.

The LFXP2-17E-5QN208I from Lattice Semiconductor Corporation is an XP2 field programmable gate array (FPGA) Integrated Circuit (282624, 17000) with 146 I/O in a 208-BFQFP package.

The 17E-1728-2 from Amphenol ICC (Commercial Products) is a two-piece 50-position D-sub backshell in silver, 180° and unshielded.

The 17E-1657-15 from Amphenol ICC (Commercial Products) is a 15-position two-piece silver shielded D-sub backshell with a 180° angle.

The LFXP2-17E-7FN484C from Lattice Semiconductor Corporation is an XP2 FPGA Integrated Circuit with 358 I/O in a 484-BBGA package (282624, 17000).

The 17E-1724-1 from Amphenol ICC (Commercial Products) is a black, two-piece 9-position backshell for D-Sub connectors, set at 180° and unshielded.

The 17E-1728-1 from Amphenol ICC (Commercial Products) is a 50-position, two-piece black backshell connector rated 180°, unshielded.

The 17E-1725-1 from Amphenol ICC (Commercial Products) is a black, unshielded 15-position two-piece D-Sub backshell connector with a 180° orientation.

The 809-054-17E from Glenair is an O-ring 17 accessory for a Mighty Mouse connector.

The LFXP2-17E-5FN484C from Lattice Semiconductor Corporation is an XP2 FPGA (282624, 17000) with 358 I/O in a 484-BBGA package.

The LFXP2-17E-5FTN256I from Lattice Semiconductor Corporation is an XP2 field-programmable gate array (FPGA) Integrated Circuit (282624, 17000) with 201 I/O in a 256-LBGA package.

The LFXP2-17E-5FTN256C from Lattice Semiconductor Corporation is an XP2 field-programmable gate array (FPGA) Integrated Circuit with 201 I/O, 282624 and 17000, in a 256-LBGA package.

The LFXP2-17E-7FTN256C from Lattice Semiconductor Corporation is an XP2 Field Programmable Gate Array (FPGA) Integrated Circuit with 201 I/O in a 256-LBGA package, alongside the numbers 282624 and 17000.

The LFXP2-17E-6FTN256I from Lattice Semiconductor Corporation is an XP2 Field Programmable Gate Array (FPGA) Integrated Circuit with 201 I/O, listing 282624 and 17000 alongside, in a 256-LBGA package.

The LFXP2-17E-6FTN256C from Lattice Semiconductor Corporation is an XP2 field-programmable gate array (FPGA) Integrated Circuit with 201 I/O, 282624 and 17000 values, in a 256-LBGA package.

The LFXP2-17E-5QN208C from Lattice Semiconductor Corporation is an XP2 field-programmable gate array (FPGA) Integrated Circuit with 146 I/O in a 208-BFQFP package, alongside the figures 282624 and 17000.

The LFXP2-17E-6QN208C from Lattice Semiconductor Corporation is an XP2 field programmable gate array (FPGA) Integrated Circuit (282624, 17000) with 146 I/O in a 208-BFQFP package.