Search results for “pushPIN”

The ATS-16A-151-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×30 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15C-129-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 × 60 × 10 mm (XCUT), for BGA, LGA, CPU and ASIC devices.

The ATS-09F-170-C3-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm R-tab heat sink (T412).

The ATS-02E-01-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The 164TL22 from TE Connectivity ALCOSWITCH Switches is a standard 4PST-2NO/2NC front-mount panel pushbutton switch with illumination, rated 5 A at 250 V.

The ATS-01D-166-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-04E-188-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm aluminum top-mount heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-14E-27-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×12.7 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-14A-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-05G-120-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 45×45×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-05D-121-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-05D-127-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03E-106-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-08G-71-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with an L-tab and T766 designation.

The ATS-05A-194-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-04E-58-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-15C-195-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×12 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-16B-159-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an L-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-10E-109-C3-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-04A-163-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 30 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-15G-50-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-FPX060060010-111-C2-R1 from Advanced Thermal Solutions Inc. is a skived aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages, measuring 60 x 60 x 9.5 mm.

The ATS-02F-115-C1-R0 from Advanced Thermal Solutions Inc. is an X-Cut heat sink measuring 40x40x20 mm.

The ATS-21F-187-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×10 mm with an R-Tab, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-09B-05-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-17F-80-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×15 mm, with an R-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-04A-74-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-15F-169-C1-R0 from Advanced Thermal Solutions Inc. is a 30 mm × 30 mm × 10 mm heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages, made of aluminum and mounted on top.

The 960-27-28-D-AB-0 from Wakefield-Vette is a 27 x 28 mm aluminum heat sink for BGA packages, with push-pin top mounting.

The ATS-15D-198-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 12 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-04F-126-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×15 mm, with an XCUT designation, for BGA, LGA, CPU and ASIC devices.

The ATS-14E-50-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 30 x 30 x 15 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-16B-146-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 35 mm aluminum heat sink with an L-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13G-21-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 × 60 × 10 mm (XCUT), for BGA, LGA, CPU and ASIC devices.