Search results for “pushPIN”

The ATS-14E-27-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×12.7 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-12A-158-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 35 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-05D-121-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-14H-138-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 25×25×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The 960-27-28-D-AB-0 from Wakefield-Vette is a 27 x 28 mm aluminum heat sink for BGA packages, with push-pin top mounting.

The ATS-17F-126-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×15 mm, with an XCUT designation, for BGA, LGA, CPU and ASIC devices.

The ATS-16C-101-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-15H-110-C3-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03E-106-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-08G-71-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with an L-tab and T766 designation.

The ATS-15D-98-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-08F-100-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 25 mm aluminum top-mount heat sink with R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-10E-109-C3-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-11C-175-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-12D-98-C1-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an R-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-04A-163-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 30 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-15G-50-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 15 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-21G-189-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×20 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-02F-115-C1-R0 from Advanced Thermal Solutions Inc. is an X-Cut heat sink measuring 40x40x20 mm.

The ATS-07G-18-C3-R0 from Advanced Thermal Solutions Inc. is a 54 x 54 x 15 mm heat sink with XCUT (T412) design.

The ATS-12H-187-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×10 mm with an R-Tab, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-09B-05-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-15F-169-C1-R0 from Advanced Thermal Solutions Inc. is a 30 mm × 30 mm × 10 mm heat sink with an R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages, made of aluminum and mounted on top.

The ATS-01D-137-C3-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-11E-74-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 25 mm × 25 mm × 15 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-12H-134-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×15 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-14E-50-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 30 x 30 x 15 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-15E-166-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-16B-146-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 35 mm aluminum heat sink with an L-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-15A-08-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm XCUT aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-07C-45-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 25 mm × 25 mm × 20 mm, for BGA, LGA, CPU and ASIC devices.

The 960-27-33-D-AB-0 from Wakefield-Vette is a diameter push-pin heat sink measuring 27 x 33 mm.

The 960-29-33-D-AB-0 from Wakefield-Vette is a 29 x 33 mm aluminum heat sink for BGA packages, with push-pin top mounting.

The ATS-19G-198-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45×45×12 mm.