Search results for “13F”

The 13F-641GGDP2NL from Yuan Dean is a 1-port RJ45 jack with magnetics, through-hole mounting, supporting 10/100 Base-T and AutoMDIX.

The ATS-13F-65-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×30 mm with an L-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-54-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×35 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-87-C3-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×20 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-65-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for BGA, LGA, CPU and ASIC devices, measuring 40 mm x 40 mm x 30 mm.

The ATS-13F-131-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 20 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-13F-93-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted devices (BGA, LGA, CPU, ASIC and others), measuring 40×40×20 mm with an R-tab (T766).

The ATS-13F-134-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 mm x 70 mm x 15 mm, for assorted BGA, LGA, CPU and ASIC packages.

The ATS-13F-81-C2-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 20 mm aluminum top-mount heat sink with R-tab for assorted BGA, LGA, CPU and ASIC devices (T766).

The ATS-13F-61-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink, 40×40×10 mm with an L-tab, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-13F-94-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×25 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-135-C3-R0 from Advanced Thermal Solutions Inc. is a 70 x 70 x 20 mm X-cut heat sink, T412.

The ATS-13F-59-C3-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 35×35×30 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-59-C2-R0 from Advanced Thermal Solutions Inc. is a 35×35×30 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-61-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-64-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×25 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-93-C3-R0 from Advanced Thermal Solutions Inc. is a 40×40×20 mm aluminum top-mount heat sink with an R-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-150-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-133-C3-R0 from Advanced Thermal Solutions Inc. is a 70 x 70 x 10 mm XCUT T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13F-132-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-13F-95-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 30 mm R-TAB heat sink.

The ATS-13F-150-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13F-150-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 25 mm L-tab heat sink (T412).

The ATS-13F-81-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 30 mm × 30 mm × 20 mm, suited to BGA, LGA, CPU and ASIC devices (T412).

The ATS-13F-130-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm heat sink (XCUT T766).

The ATS-13F-61-C2-R0 from Advanced Thermal Solutions Inc. is a 40×40×10 mm aluminum L-tab heat sink with a T766 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-82-C2-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 25 mm R-tab T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13F-50-C2-R0 from Advanced Thermal Solutions Inc. is a L-Tab heat sink measuring 30x30x15 mm, T766 series.

The ATS-13F-74-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 25×25×15 mm with an R-tab profile and T766 designation.

The ATS-13F-156-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×25 mm, with an L-TAB T412 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-43-C3-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13F-95-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×30 mm with an R-tab profile and T412 designation.

The ATS-13F-137-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm aluminum L-tab heat sink for top mounting, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13F-198-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 45×45×12 mm.

The ATS-13F-116-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13F-56-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 15 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13F-20-C2-R0 from Advanced Thermal Solutions Inc. is a 54 x 54 x 25 mm heat sink, XCUT (T766).

The ATS-13F-103-C1-R1 from Advanced Thermal Solutions Inc. is a 40×40×9.5 mm XCUT aluminum heat sink with top mounting, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-30-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70x70x25 mm with XCUT (T766) styling, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-65-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×30 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-13F-94-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-13F-86-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 35×35×15 mm with an R-tab profile and T412 designation.