Search results for “ATS-13D”

The ATS-13D-135-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 70 x 70 x 20 mm.

The ATS-13D-150-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 35 mm × 35 mm × 25 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-13-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×15 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-65-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for BGA, LGA, CPU and ASIC devices, measuring 40 mm x 40 mm x 30 mm.

The ATS-13D-97-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an R-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-97-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×10 mm with an R-Tab, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-50-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 30 x 30 x 15 mm, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-37-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 17.78 mm.

The ATS-13D-30-C1-R0 from Advanced Thermal Solutions Inc. is a 70 mm × 70 mm × 25 mm XCUT heat sink of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-51-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 30 x 30 x 20 mm.

The ATS-13D-194-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×10 mm with an X-cut design, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-13-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 50×50×15 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-13D-53-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×30 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-181-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40 x 40 x 10 mm with an R-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-13D-01-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-64-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab heat sink measuring 40 mm x 40 mm x 25 mm (T766).

The ATS-13D-150-C1-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 25 mm heat sink with L-TAB.

The ATS-13D-191-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×30 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-152-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 35 mm, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-81-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab heat sink measuring 30 x 30 x 20 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-13D-130-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 60 mm × 60 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-81-C2-R0 from Advanced Thermal Solutions Inc. is a 30 mm x 30 mm x 20 mm R-tab heat sink (T766).

The ATS-13D-131-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 20 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-131-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 20 mm, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-13D-53-C3-R0 from Advanced Thermal Solutions Inc. is a 30×30×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-143-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 30 x 30 x 20 mm.

The ATS-13D-54-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 35 mm aluminum heat sink with an L-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-64-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab heat sink measuring 40 x 40 x 25 mm.

The ATS-13D-50-C3-R0 from Advanced Thermal Solutions Inc. is a 30 mm x 30 mm x 15 mm L-tab aluminum heat sink (T412) for top mounting.

The ATS-13D-150-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 25 mm L-tab heat sink (T412).

The ATS-13D-133-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-55-C1-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm heat sink with an L-tab.

The ATS-13D-87-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 20 mm with an R-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-13D-125-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 54×54×10 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-53-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 30 x 30 x 30 mm, with L-TAB code.

The ATS-13D-85-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab aluminum top-mount heat sink measuring 35×35×10 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-184-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-165-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13D-73-C2-R0 from Advanced Thermal Solutions Inc. is a 25 mm × 25 mm × 10 mm aluminum top-mount heat sink with R-tab for assorted devices such as BGA, LGA, CPU and ASIC packages (T766).

The ATS-13D-70-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 45x45x25 mm.

The ATS-13D-75-C1-R0 from Advanced Thermal Solutions Inc. is an R-TAB heat sink measuring 25 x 25 x 20 mm.

The ATS-13D-141-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×10 mm, with an L-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-73-C1-R0 from Advanced Thermal Solutions Inc. is a 25 x 25 x 10 mm R-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-13D-145-C3-R0 from Advanced Thermal Solutions Inc. is a 30×30×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-13D-121-C2-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-13D-94-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-13D-97-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, with an R-tab and T412 designation.

The ATS-13D-81-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an R-tab, measuring 30 mm × 30 mm × 20 mm, suited to BGA, LGA, CPU and ASIC devices (T412).