Search results for “ATS-03F”

The ATS-03F-44-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 25×25×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-136-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink measuring 70 x 70 x 25 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03F-147-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for BGA, LGA, CPU and ASIC devices, measuring 35 x 35 x 10 mm.

The ATS-03F-127-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 20 mm XCUT (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-124-C3-R0 from Advanced Thermal Solutions Inc. is a 50×50×25 mm cross-cut (XCUT) aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-91-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×10 mm with an R-tab and T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-41-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 60.96 x 17.78 mm, suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03F-16-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 54×54×10 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-182-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-59-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 30 mm with an L-tab, suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03F-204-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 54 x 54 x 12 mm.

The ATS-03F-204-C2-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 12 mm XCUT (T766) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-98-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-03F-152-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 35 x 35 x 35 mm with an L-TAB design, assorted for BGA, LGA, CPU and ASIC devices.

The ATS-03F-186-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 35 mm R-tab T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-08-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-19-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-205-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted devices (BGA, LGA, CPU, ASIC) with XCUT T766 designation.

The ATS-03F-92-C2-R0 from Advanced Thermal Solutions Inc. is an R-tab top-mount aluminum heat sink measuring 40 mm × 40 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-174-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 30×30×35 mm with an R-tab profile and T412 designation.

The ATS-03F-130-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-111-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-03F-121-C1-R0 from Advanced Thermal Solutions Inc. is a 50×50×10 mm aluminum top-mount heat sink with an X-cut design, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-205-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 6 mm XCUT aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-202-C1-R0 from Advanced Thermal Solutions Inc. is a 54 mm x 54 mm x 6 mm XCUT aluminum heat sink for top mounting.

The ATS-03F-124-C2-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 25 mm XCUT T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-142-C3-R0 from Advanced Thermal Solutions Inc. is a 30 mm x 30 mm x 15 mm L-tab aluminum heat sink (T412) for top mounting.

The ATS-03F-45-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 25 mm × 25 mm × 20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-38-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 36.83×57.6×22.86 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-103-C2-R1 from Advanced Thermal Solutions Inc. is a T766 heat sink measuring 40 x 40 x 9.5 mm with XCUT.

The ATS-03F-189-C1-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 45x45x20 mm with an R-tab mounting style.

The ATS-03F-135-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×20 mm with an XCUT T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-47-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 25x25x30 mm with an L-tab mounting style (T766).

The ATS-03F-196-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45 × 45 × 6 mm (XCUT), for BGA, LGA, CPU and ASIC devices.

The ATS-03F-62-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 40×40×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-57-C2-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 35x35x20 mm with an L-tab mounting style (T766).

The ATS-03F-10-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 45×45×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-174-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount R-tab T766 heat sink measuring 30 x 30 x 35 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03F-147-C3-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 10 mm aluminum top-mount heat sink with L-tab for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-178-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 35 x 35 x 25 mm with R-TAB.

The ATS-03F-19-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-144-C1-R0 from Advanced Thermal Solutions Inc. is a 30 mm × 30 mm × 25 mm L-TAB heat sink of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-09-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-02-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×12.7 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-41-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 57.9 x 60.96 x 17.78 mm, T766 series.

The ATS-03F-127-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-150-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 35x35x25 mm with an L-tab mounting style (T412).