Search results for “ATS-03F”

The ATS-03F-208-C1-R0 from Advanced Thermal Solutions Inc. is an X-cut heat sink measuring 70 x 70 x 6 mm.

The ATS-03F-58-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-28-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×15 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-09-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (XCUT, T766) measuring 45 x 45 x 20 mm.

The ATS-03F-01-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×10 mm with an X-cut design, for use with assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-10-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-18-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-146-C1-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 35 mm aluminum heat sink with an L-tab top mount, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-45-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×20 mm with an L-tab and T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-193-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40x40x6 mm.

The ATS-03F-125-C3-R0 from Advanced Thermal Solutions Inc. is a 54×54×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-140-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×25 mm aluminum top-mount heat sink with an L-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-57-C3-R0 from Advanced Thermal Solutions Inc. is a 35×35×20 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-47-C1-R0 from Advanced Thermal Solutions Inc. is a 25×25×30 mm aluminum L-tab heat sink for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-150-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 35×35×25 mm with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-176-C2-R0 from Advanced Thermal Solutions Inc. is a 35 x 35 x 15 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages (R-TAB T766).

The ATS-03F-133-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-12-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50×50×12.7 mm (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-03F-64-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab heat sink measuring 40 x 40 x 25 mm.

The ATS-03F-18-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×15 mm, with an XCUT designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-136-C1-R0 from Advanced Thermal Solutions Inc. is a 70 mm × 70 mm × 25 mm XCUT heat sink of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-65-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for BGA, LGA, CPU and ASIC devices, measuring 40 mm x 40 mm x 30 mm.

The ATS-03F-197-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45×45×10 mm, with an XCUT T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-22-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-10-C2-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages (XCUT T766).

The ATS-03F-125-C2-R0 from Advanced Thermal Solutions Inc. is a 54 x 54 x 10 mm heat sink (XCUT, T766).

The ATS-03F-178-C2-R0 from Advanced Thermal Solutions Inc. is a heat sink (R-TAB, T766) measuring 35 x 35 x 25 mm.

The ATS-03F-74-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 25×25×15 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-117-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-48-C3-R0 from Advanced Thermal Solutions Inc. is a 25×25×35 mm aluminum top-mount heat sink with an L-tab (T412), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-160-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 15 mm L-TAB (T412) aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-112-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 60.00 mm x 60.00 mm.

The ATS-03F-27-C2-R0 from Advanced Thermal Solutions Inc. is a 70 x 70 x 12.7 mm heat sink (XCUT T766) for thermal management.

The ATS-03F-134-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 mm x 70 mm x 15 mm, for assorted BGA, LGA, CPU and ASIC packages.

The ATS-03F-141-C2-R0 from Advanced Thermal Solutions Inc. is a 30×30×10 mm aluminum top-mount heat sink with an L-tab (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-134-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×15 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-126-C3-R0 from Advanced Thermal Solutions Inc. is a 54 mm x 54 mm x 15 mm XCUT aluminum heat sink (T412) for top mounting.

The ATS-03F-64-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×25 mm, with an L-TAB T412 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-44-C1-R0 from Advanced Thermal Solutions Inc. is a heat sink (L-TAB) measuring 25 x 25 x 15 mm.

The ATS-03F-114-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 40×40×15 mm with an X-cut profile.

The ATS-03F-154-C2-R0 from Advanced Thermal Solutions Inc. is an L-tab aluminum top-mount heat sink measuring 40×40×15 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-108-C3-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-194-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-118-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm XCUT aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-72-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 45x45x35 mm.

The ATS-03F-147-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 35 x 35 x 10 mm (T766).

The ATS-03F-107-C1-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-119-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 20 mm aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.