Search results for “ATS-03F”

The ATS-03F-122-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 50×50×15 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-03F-136-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70x70x25 mm with XCUT (T766) styling, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-210-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount XCUT T412 heat sink measuring 70 x 70 x 12 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03F-68-C2-R0 from Advanced Thermal Solutions Inc. is a 45×45×15 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-144-C2-R0 from Advanced Thermal Solutions Inc. is a 30×30×25 mm L-tab aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-09-C3-R0 from Advanced Thermal Solutions Inc. is a 45 mm x 45 mm x 20 mm aluminum top-mount heat sink with X-Cut R-Tab for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03F-109-C2-R1 from Advanced Thermal Solutions Inc. is a 54.00 mm x 54.00 mm aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC applications.

The ATS-03F-23-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 60 mm × 60 mm × 15 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-134-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×15 mm with an XCUT T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-27-C1-R0 from Advanced Thermal Solutions Inc. is a 70 mm × 70 mm × 12.7 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-129-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-03F-05-C3-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 40×40×25 mm (T412), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-135-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-38-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for assorted BGA, LGA, CPU and ASIC devices, measuring 36.83 x 57.6 x 22.86 mm (T766).

The ATS-03F-132-C2-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 25 mm XCUT heat sink (T766) of aluminum for top mounting, suited to assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-153-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 10 mm heat sink with an L-TAB.

The ATS-03F-138-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab (T412) for assorted BGA, LGA, CPU and ASIC devices, measuring 25x25x15 mm.

The ATS-03F-13-C1-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 50×50×15 mm, intended for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-152-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 35 mm, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-120-C1-R0 from Advanced Thermal Solutions Inc. is a 45 mm × 45 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-145-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×30 mm, with an L-TAB T766 designation, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-149-C1-R0 from Advanced Thermal Solutions Inc. is a 35×35×20 mm aluminum top-mount heat sink with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-02-C3-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 12.7 mm XCUT T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-141-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30×30×10 mm, with an L-TAB, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-14-C2-R0 from Advanced Thermal Solutions Inc. is a 50 x 50 x 20 mm X-cut heat sink (T766).

The ATS-03F-145-C3-R0 from Advanced Thermal Solutions Inc. is a 30×30×30 mm aluminum L-tab heat sink with a T412 designation, for top mounting on assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-106-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-03F-164-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink with an L-tab for assorted BGA, LGA, CPU and ASIC devices, measuring 45x45x35 mm.

The ATS-03F-145-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 30x30x30 mm with an L-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-115-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-197-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 45 mm × 45 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-158-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 35 mm L-tab aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-06-C3-R0 from Advanced Thermal Solutions Inc. is a 45×45×10 mm aluminum top-mount heat sink with an XCUT form and a T412 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-148-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 15 mm, suited to BGA, LGA, CPU and ASIC devices.

The ATS-03F-109-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum heat sink measuring 54.00 mm x 54.00 mm.

The ATS-03F-126-C1-R0 from Advanced Thermal Solutions Inc. is a 54 x 54 x 15 mm heat sink (XCUT).

The ATS-03F-01-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-07-C3-R0 from Advanced Thermal Solutions Inc. is an assorted-application aluminum heat sink (for BGA, LGA, CPU, ASIC and similar devices) measuring 45x45x12.7 mm, with top mount and XCUT (T412) design.

The ATS-03F-15-C3-R0 from Advanced Thermal Solutions Inc. is a 50×50×25 mm cross-cut (XCUT) aluminum heat sink with top mounting, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-139-C1-R0 from Advanced Thermal Solutions Inc. is an L-tab top-mount aluminum heat sink measuring 25 mm × 25 mm × 20 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-104-C1-R1 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x12.7 mm with XCUT styling, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-105-C1-R1 from Advanced Thermal Solutions Inc. is a 45.00 mm x 45.00 mm aluminum heat sink for top mounting.

The ATS-03F-42-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9×60.96×22.86 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-108-C1-R1 from Advanced Thermal Solutions Inc. is a 50 mm × 50 mm aluminum top-mount heat sink, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-68-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×15 mm with an L-tab, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-108-C2-R1 from Advanced Thermal Solutions Inc. is an aluminum heat sink measuring 50.00 mm x 50.00 mm.

The ATS-03F-104-C3-R1 from Advanced Thermal Solutions Inc. is a 40 x 40 x 12.7 mm XCUT T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-207-C2-R0 from Advanced Thermal Solutions Inc. is a cross-cut aluminum top-mount heat sink measuring 60×60×12 mm (T766), intended for assorted devices such as BGA, LGA, CPU and ASIC packages.