Search results for “ATS-03F”

The ATS-03F-29-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices, measuring 70 x 70 x 20 mm.

The ATS-03F-26-C3-R0 from Advanced Thermal Solutions Inc. is a 70 x 70 x 10 mm XCUT T412 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-25-C2-R0 from Advanced Thermal Solutions Inc. is an XCUT heat sink measuring 60 x 60 x 25 mm (T766).

The ATS-03F-60-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount L-tab heat sink measuring 35 x 35 x 35 mm, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-24-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 20 mm heat sink with XCUT.

The ATS-03F-126-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×15 mm aluminum top-mount heat sink with an X-cut design (T766), for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-172-C2-R0 from Advanced Thermal Solutions Inc. is a 30 x 30 x 25 mm R-tab T766 aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-184-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40x40x25 mm with an R-tab, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-41-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 60.96 x 17.78 mm, suited to assorted BGA, LGA, CPU and ASIC packages.

The ATS-03F-17-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 54×54×12.7 mm, XCUT, intended for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-29-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-210-C1-R0 from Advanced Thermal Solutions Inc. is a 70 x 70 x 12 mm heat sink (XCUT).

The ATS-03F-113-C2-R0 from Advanced Thermal Solutions Inc. is a 40 mm × 40 mm × 10 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-129-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T412).

The ATS-03F-05-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×25 mm with an XCUT T766 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-20-C1-R0 from Advanced Thermal Solutions Inc. is a 54 mm × 54 mm × 25 mm XCUT aluminum top-mount heat sink for BGA, LGA, CPU and ASIC devices.

The ATS-03F-21-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 60×60×10 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices (T766).

The ATS-03F-132-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 25 mm with an X-cut (T412), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03F-70-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 45x45x25 mm with an L-tab (T412), for BGA, LGA, CPU and ASIC devices.

The ATS-03F-109-C3-R1 from Advanced Thermal Solutions Inc. is an aluminum heat sink measuring 54.00 mm x 54.00 mm.

The ATS-03F-42-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 57.9 x 60.96 x 22.86 mm (T766), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03F-117-C1-R0 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 45 mm × 45 mm × 10 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-129-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 × 60 × 10 mm (XCUT), for BGA, LGA, CPU and ASIC devices.

The ATS-03F-178-C3-R0 from Advanced Thermal Solutions Inc. is a R-Tab heat sink measuring 35x35x25 mm, T412 series.

The ATS-03F-132-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 25 mm heat sink with XCUT.

The ATS-03F-127-C2-R0 from Advanced Thermal Solutions Inc. is a 54×54×20 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-26-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-110-C3-R1 from Advanced Thermal Solutions Inc. is an aluminum heat sink measuring 54.00 mm x 54.00 mm.

The ATS-03F-28-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 70 mm x 70 mm x 15 mm, for assorted BGA, LGA, CPU and ASIC packages.

The ATS-03F-103-C3-R1 from Advanced Thermal Solutions Inc. is an XCUT top-mount aluminum heat sink measuring 40 mm × 40 mm × 9.5 mm, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-25-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 60 x 60 x 25 mm with an X-cut (T412), suitable for BGA, LGA, CPU and ASIC devices.

The ATS-03F-26-C2-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form and a T766 designation, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-28-C3-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 70×70×15 mm with an XCUT T412 profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-133-C1-R0 from Advanced Thermal Solutions Inc. is a 70×70×10 mm aluminum top-mount heat sink with an XCUT form, for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-05-C1-R0 from Advanced Thermal Solutions Inc. is a 40 x 40 x 25 mm XCUT thermal heat sink.

The ATS-03F-07-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 45×45×12.7 mm with an X-cut design, for BGA, LGA, CPU and ASIC devices.

The ATS-03F-165-C3-R0 from Advanced Thermal Solutions Inc. is a heat sink measuring 25 x 25 x 10 mm with R-TAB (T412).

The ATS-03F-08-C1-R0 from Advanced Thermal Solutions Inc. is a 45 x 45 x 15 mm XCUT aluminum heat sink for top mounting on BGA, LGA, CPU and ASIC devices.

The ATS-03F-04-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 40×40×20 mm (T766), for BGA, LGA, CPU and ASIC devices.

The ATS-03F-04-C3-R0 from Advanced Thermal Solutions Inc. is a top-mount aluminum heat sink for BGA, LGA, CPU and ASIC devices, measuring 40x40x20 mm with an XCUT style (T412).

The ATS-03F-131-C1-R0 from Advanced Thermal Solutions Inc. is a 60 mm × 60 mm × 20 mm aluminum top-mount heat sink for assorted devices such as BGA, LGA, CPU and ASIC packages.

The ATS-03F-122-C2-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink measuring 50 x 50 x 15 mm, for assorted BGA, LGA, CPU and ASIC applications (T766).

The ATS-03F-23-C2-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm heat sink (XCUT T766).

The ATS-03F-04-C1-R0 from Advanced Thermal Solutions Inc. is an aluminum top-mount heat sink, 40×40×20 mm with an XCUT profile, for assorted BGA, LGA, CPU and ASIC devices.

The ATS-03F-23-C3-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 15 mm XCUT heat sink (T412).

The ATS-03F-25-C1-R0 from Advanced Thermal Solutions Inc. is a 60 x 60 x 25 mm heat sink with XCUT.