| Manuf | Datasheet |
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XCVU19P-2FSVA3824E |
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Manufacturer
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Part Number
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XCVU19P-2FSVA3824E
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Product Description
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The XCVU19P-2FSVA3824E is a cutting-edge FPGA from Xilinx’s Virtex UltraScale+ family, designed for high-performance computing and advanced signal processing applications. This device features UltraRAM and HBM (High Bandwidth Memory) integration, offering unparalleled memory bandwidth critical for data-intensive tasks. With 16nm FinFET technology, the FPGA delivers high efficiency, exceptional logic density, and low power consumption. The package type, FSVA3824, indicates a Flip-Chip Ball Grid Array (FCBGA) with 3824 pins, ensuring robust connectivity and high-speed I/O capabilities. The "-2" speed grade signifies the device's high-performance capability, while the "E" suffix indicates extended temperature range support. This FPGA is optimized for AI acceleration, 5G communication systems, high-performance computing (HPC), and complex data centers, making it an industry-leading choice for advanced applications.
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SKU |
XCVU19P2FSVA3824E-7693077 |
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Other Description
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XCVU19P-2FSVA3824E is an Uncategorized product.
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Type
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Description
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Export Control |
3A001A7B |
Documentation |
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Harmonized Tariff |
8542.31.0060 |
Moisture Sensitivity Level |
4 at 72 Hours |
Alternates |
773-XCVU19P-2FSVA3824E - XCVU19P-2FSVA3824 - XCVU19P2FSVA3824E |
Packaging |
3824-FCBGA (65x65) |
SVHC-Free |
REACH is Unaffected
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RoHS Compliance |
ROHS3-Compliant |
Part Series |
Virtex UltraScale+ |
Qty Available |
1 |
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